LED packaging structure

LED packaging structure

The utility model relates to and discloses a LED packaging structure, is in the problem that leads to the easy disconnection of solder joint on the LED heat dissipation channel for solving among the prior art lead bonding solder joint, the utility model discloses in be provided with metal heat dissi...

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Hauptverfasser: LI ZHENNING, XING QIBIN, HOU LI, TONG WENPENG
Format: Patent
Sprache:eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator LI ZHENNING
XING QIBIN
HOU LI
TONG WENPENG
description The utility model relates to and discloses a LED packaging structure, is in the problem that leads to the easy disconnection of solder joint on the LED heat dissipation channel for solving among the prior art lead bonding solder joint, the utility model discloses in be provided with metal heat dissipation dish, first and second metal pad to at least one LED chip, on this LED chip was fixed in metal heat dissipation dish, the first second ploe of LED chip was connected through lead wire and first second metal pad electricity respectively, it is insulating each other between second metal pad and the metal heat dissipation dish, perhaps, second metal pad with metal heat dissipation dish is connected and is extended towards the direction of keeping away from the heat dissipation channel of this metal heat dissipation dish. The solder joint that lead bonding between LED chip and the metal pad can be guaranteed to above -mentioned scheme can result in the problem of solder joint disconnection, and then can effectively promote LED reliability of an item not on heat dissipation channel when avoiding LED device reflow soldering or self inner heat.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN204991758UU</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN204991758UU</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN204991758UU3</originalsourceid><addsrcrecordid>eNrjZBD3cXVRKEhMzk5Mz8xLVyguKSpNLiktSuVhYE1LzClO5YXS3AxKbq4hzh66qQX58anFQB2peakl8c5-RgYmlpaG5qYWoaHGRCkCAPm0Ipc</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>LED packaging structure</title><source>esp@cenet</source><creator>LI ZHENNING ; XING QIBIN ; HOU LI ; TONG WENPENG</creator><creatorcontrib>LI ZHENNING ; XING QIBIN ; HOU LI ; TONG WENPENG</creatorcontrib><description>The utility model relates to and discloses a LED packaging structure, is in the problem that leads to the easy disconnection of solder joint on the LED heat dissipation channel for solving among the prior art lead bonding solder joint, the utility model discloses in be provided with metal heat dissipation dish, first and second metal pad to at least one LED chip, on this LED chip was fixed in metal heat dissipation dish, the first second ploe of LED chip was connected through lead wire and first second metal pad electricity respectively, it is insulating each other between second metal pad and the metal heat dissipation dish, perhaps, second metal pad with metal heat dissipation dish is connected and is extended towards the direction of keeping away from the heat dissipation channel of this metal heat dissipation dish. The solder joint that lead bonding between LED chip and the metal pad can be guaranteed to above -mentioned scheme can result in the problem of solder joint disconnection, and then can effectively promote LED reliability of an item not on heat dissipation channel when avoiding LED device reflow soldering or self inner heat.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2016</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20160120&amp;DB=EPODOC&amp;CC=CN&amp;NR=204991758U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76419</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20160120&amp;DB=EPODOC&amp;CC=CN&amp;NR=204991758U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LI ZHENNING</creatorcontrib><creatorcontrib>XING QIBIN</creatorcontrib><creatorcontrib>HOU LI</creatorcontrib><creatorcontrib>TONG WENPENG</creatorcontrib><title>LED packaging structure</title><description>The utility model relates to and discloses a LED packaging structure, is in the problem that leads to the easy disconnection of solder joint on the LED heat dissipation channel for solving among the prior art lead bonding solder joint, the utility model discloses in be provided with metal heat dissipation dish, first and second metal pad to at least one LED chip, on this LED chip was fixed in metal heat dissipation dish, the first second ploe of LED chip was connected through lead wire and first second metal pad electricity respectively, it is insulating each other between second metal pad and the metal heat dissipation dish, perhaps, second metal pad with metal heat dissipation dish is connected and is extended towards the direction of keeping away from the heat dissipation channel of this metal heat dissipation dish. The solder joint that lead bonding between LED chip and the metal pad can be guaranteed to above -mentioned scheme can result in the problem of solder joint disconnection, and then can effectively promote LED reliability of an item not on heat dissipation channel when avoiding LED device reflow soldering or self inner heat.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2016</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBD3cXVRKEhMzk5Mz8xLVyguKSpNLiktSuVhYE1LzClO5YXS3AxKbq4hzh66qQX58anFQB2peakl8c5-RgYmlpaG5qYWoaHGRCkCAPm0Ipc</recordid><startdate>20160120</startdate><enddate>20160120</enddate><creator>LI ZHENNING</creator><creator>XING QIBIN</creator><creator>HOU LI</creator><creator>TONG WENPENG</creator><scope>EVB</scope></search><sort><creationdate>20160120</creationdate><title>LED packaging structure</title><author>LI ZHENNING ; XING QIBIN ; HOU LI ; TONG WENPENG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN204991758UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2016</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>LI ZHENNING</creatorcontrib><creatorcontrib>XING QIBIN</creatorcontrib><creatorcontrib>HOU LI</creatorcontrib><creatorcontrib>TONG WENPENG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LI ZHENNING</au><au>XING QIBIN</au><au>HOU LI</au><au>TONG WENPENG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>LED packaging structure</title><date>2016-01-20</date><risdate>2016</risdate><abstract>The utility model relates to and discloses a LED packaging structure, is in the problem that leads to the easy disconnection of solder joint on the LED heat dissipation channel for solving among the prior art lead bonding solder joint, the utility model discloses in be provided with metal heat dissipation dish, first and second metal pad to at least one LED chip, on this LED chip was fixed in metal heat dissipation dish, the first second ploe of LED chip was connected through lead wire and first second metal pad electricity respectively, it is insulating each other between second metal pad and the metal heat dissipation dish, perhaps, second metal pad with metal heat dissipation dish is connected and is extended towards the direction of keeping away from the heat dissipation channel of this metal heat dissipation dish. The solder joint that lead bonding between LED chip and the metal pad can be guaranteed to above -mentioned scheme can result in the problem of solder joint disconnection, and then can effectively promote LED reliability of an item not on heat dissipation channel when avoiding LED device reflow soldering or self inner heat.</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title LED packaging structure
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-07T23%3A29%3A10IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=LI%20ZHENNING&rft.date=2016-01-20&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN204991758UU%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true