Lead frame that can directly pile up

Lead frame that can directly pile up

The utility model provides a lead frame that can directly pile up, relates to the chip technology field, and its structure includes the frame body, the frame body is equipped with and is used for separating the supporting legs rather than adjacent lead frame when a plurality of lead frames pile up,...

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Hauptverfasser: LUO YANLING, TAO SHAOYONG
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator LUO YANLING
TAO SHAOYONG
description The utility model provides a lead frame that can directly pile up, relates to the chip technology field, and its structure includes the frame body, the frame body is equipped with and is used for separating the supporting legs rather than adjacent lead frame when a plurality of lead frames pile up, and through being equipped with the supporting legs at the frame body, when a plurality of lead frames piled up, two adjacent lead frames were separated through this supporting legs, separates with regard to not using the intermediary paper, saves the cost, and the workman need not lay the intermediary paper, does not also need during the board operation to take away the intermediary paper earlier, consequently, can improve production efficiency.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Lead frame that can directly pile up
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