Fingerprint identification module point is glued to be constructed

The utility model relates to a fingerprint identification module point is glued to be constructed, including flexible circuit board, chip and becket, wherein, the chip paster is on the board of flexible line way, the chip is filled with to fill to circuit board fringe region point all around and glu...

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Hauptverfasser:	LAI JINHONG, WANG CHUNLI
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL PERFORMING OPERATIONS SPRAYING OR ATOMISING IN GENERAL TRANSPORTING
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creator	LAI JINHONG WANG CHUNLI
description	The utility model relates to a fingerprint identification module point is glued to be constructed, including flexible circuit board, chip and becket, wherein, the chip paster is on the board of flexible line way, the chip is filled with to fill to circuit board fringe region point all around and glues, the part of becket is seted up porosely, trompil department point has conductive silver adhesive, the becket keeps switching on with flexible line way board through conductive silver adhesive. The glued structure of applied this point can reduce a little glues the required precision, improves production efficiency, avoid the disabler, the yield of improving production, and can reduce production cost.
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subjects	APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL PERFORMING OPERATIONS SPRAYING OR ATOMISING IN GENERAL TRANSPORTING
title	Fingerprint identification module point is glued to be constructed
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