COB board

COB board

The utility model relates to a COB board, including PCB board, main control chip, pin and golden finger, main control chip, pin and golden finger welding are in on the PCB board, main control chip with the golden finger links to each other, the golden finger distributes around the main control chip,...

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1. Verfasser: YAN SHILIANG
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator YAN SHILIANG
description The utility model relates to a COB board, including PCB board, main control chip, pin and golden finger, main control chip, pin and golden finger welding are in on the PCB board, main control chip with the golden finger links to each other, the golden finger distributes around the main control chip, with the one deck resin on PCB board, main control chip, pin and the golden finger. The utility model discloses can realize adopting the COB board of resin package the same with the COB board test performance who adopts the ceramic package, replace the pottery to practice thrift the cost for the enterprise with the resin.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN204706562UU</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN204706562UU</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN204706562UU3</originalsourceid><addsrcrecordid>eNrjZOB09ndSSMpPLErhYWBNS8wpTuWF0twMSm6uIc4euqkF-fGpxQWJyal5qSXxzn5GBibmBmamZkahocZEKQIAnQscwA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>COB board</title><source>esp@cenet</source><creator>YAN SHILIANG</creator><creatorcontrib>YAN SHILIANG</creatorcontrib><description>The utility model relates to a COB board, including PCB board, main control chip, pin and golden finger, main control chip, pin and golden finger welding are in on the PCB board, main control chip with the golden finger links to each other, the golden finger distributes around the main control chip, with the one deck resin on PCB board, main control chip, pin and the golden finger. The utility model discloses can realize adopting the COB board of resin package the same with the COB board test performance who adopts the ceramic package, replace the pottery to practice thrift the cost for the enterprise with the resin.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2015</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20151014&amp;DB=EPODOC&amp;CC=CN&amp;NR=204706562U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20151014&amp;DB=EPODOC&amp;CC=CN&amp;NR=204706562U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YAN SHILIANG</creatorcontrib><title>COB board</title><description>The utility model relates to a COB board, including PCB board, main control chip, pin and golden finger, main control chip, pin and golden finger welding are in on the PCB board, main control chip with the golden finger links to each other, the golden finger distributes around the main control chip, with the one deck resin on PCB board, main control chip, pin and the golden finger. The utility model discloses can realize adopting the COB board of resin package the same with the COB board test performance who adopts the ceramic package, replace the pottery to practice thrift the cost for the enterprise with the resin.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2015</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZOB09ndSSMpPLErhYWBNS8wpTuWF0twMSm6uIc4euqkF-fGpxQWJyal5qSXxzn5GBibmBmamZkahocZEKQIAnQscwA</recordid><startdate>20151014</startdate><enddate>20151014</enddate><creator>YAN SHILIANG</creator><scope>EVB</scope></search><sort><creationdate>20151014</creationdate><title>COB board</title><author>YAN SHILIANG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN204706562UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2015</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>YAN SHILIANG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>YAN SHILIANG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>COB board</title><date>2015-10-14</date><risdate>2015</risdate><abstract>The utility model relates to a COB board, including PCB board, main control chip, pin and golden finger, main control chip, pin and golden finger welding are in on the PCB board, main control chip with the golden finger links to each other, the golden finger distributes around the main control chip, with the one deck resin on PCB board, main control chip, pin and the golden finger. The utility model discloses can realize adopting the COB board of resin package the same with the COB board test performance who adopts the ceramic package, replace the pottery to practice thrift the cost for the enterprise with the resin.</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title COB board
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-26T07%3A27%3A42IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=YAN%20SHILIANG&rft.date=2015-10-14&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN204706562UU%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true