Processing temperature control device for insulating layer pressure board
The utility model relates to a processing temperature control device for insulating layer pressure boards. The processing temperature control device comprises multiple mutually independent heating plates which all adopts internal control structures. Two ends of each heating plate are communicated wi...
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| creator | CHEN DONG WANG LIN ZHOU WEI WANG WEIDONG XU WANGGAN |
| description | The utility model relates to a processing temperature control device for insulating layer pressure boards. The processing temperature control device comprises multiple mutually independent heating plates which all adopts internal control structures. Two ends of each heating plate are communicated with a steam storage tank disposed outside the heating plates. The heating plates and the steam storage tank are connected through air inlet pipelines. A temperature control valve is disposed in each air inlet pipe line. Spoilers are disposed in two end positions inside each heating plate. The length of each spoiler in the radial direction of the heating plate is gradually increased from the end of the heating plate where the spoiler is located to the center position of the heating plate. with the adoption of the processing temperature control device for insulating layer pressure boards disclosed in the technical scheme, steam can go inside the heating plate and spread along the inner wall of the heating plate under the effect of the spoiler, and thus the steam heat can be transferred to the end face of the heating plate faster and the temperature of the heating plate can reach a required temperature rapidly; and accordingly the temperature control efficiency is improved. |
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The processing temperature control device comprises multiple mutually independent heating plates which all adopts internal control structures. Two ends of each heating plate are communicated with a steam storage tank disposed outside the heating plates. The heating plates and the steam storage tank are connected through air inlet pipelines. A temperature control valve is disposed in each air inlet pipe line. Spoilers are disposed in two end positions inside each heating plate. The length of each spoiler in the radial direction of the heating plate is gradually increased from the end of the heating plate where the spoiler is located to the center position of the heating plate. with the adoption of the processing temperature control device for insulating layer pressure boards disclosed in the technical scheme, steam can go inside the heating plate and spread along the inner wall of the heating plate under the effect of the spoiler, and thus the steam heat can be transferred to the end face of the heating plate faster and the temperature of the heating plate can reach a required temperature rapidly; and accordingly the temperature control efficiency is improved.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CABLES ; CONDUCTORS ; ELECTRICITY ; INSULATORS ; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</subject><creationdate>2015</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20150318&DB=EPODOC&CC=CN&NR=204215830U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20150318&DB=EPODOC&CC=CN&NR=204215830U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CHEN DONG</creatorcontrib><creatorcontrib>WANG LIN</creatorcontrib><creatorcontrib>ZHOU WEI</creatorcontrib><creatorcontrib>WANG WEIDONG</creatorcontrib><creatorcontrib>XU WANGGAN</creatorcontrib><title>Processing temperature control device for insulating layer pressure board</title><description>The utility model relates to a processing temperature control device for insulating layer pressure boards. The processing temperature control device comprises multiple mutually independent heating plates which all adopts internal control structures. Two ends of each heating plate are communicated with a steam storage tank disposed outside the heating plates. The heating plates and the steam storage tank are connected through air inlet pipelines. A temperature control valve is disposed in each air inlet pipe line. Spoilers are disposed in two end positions inside each heating plate. The length of each spoiler in the radial direction of the heating plate is gradually increased from the end of the heating plate where the spoiler is located to the center position of the heating plate. with the adoption of the processing temperature control device for insulating layer pressure boards disclosed in the technical scheme, steam can go inside the heating plate and spread along the inner wall of the heating plate under the effect of the spoiler, and thus the steam heat can be transferred to the end face of the heating plate faster and the temperature of the heating plate can reach a required temperature rapidly; and accordingly the temperature control efficiency is improved.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CABLES</subject><subject>CONDUCTORS</subject><subject>ELECTRICITY</subject><subject>INSULATORS</subject><subject>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2015</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZPAMKMpPTi0uzsxLVyhJzS1ILUosKS1KVUjOzyspys9RSEkty0xOVUjLL1LIzCsuzUksAanMSaxMLVIoKAJqBClOyk8sSuFhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfHOfkYGJkaGphbGBqGhxkQpAgDI3DZV</recordid><startdate>20150318</startdate><enddate>20150318</enddate><creator>CHEN DONG</creator><creator>WANG LIN</creator><creator>ZHOU WEI</creator><creator>WANG WEIDONG</creator><creator>XU WANGGAN</creator><scope>EVB</scope></search><sort><creationdate>20150318</creationdate><title>Processing temperature control device for insulating layer pressure board</title><author>CHEN DONG ; WANG LIN ; ZHOU WEI ; WANG WEIDONG ; XU WANGGAN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN204215830UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2015</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CABLES</topic><topic>CONDUCTORS</topic><topic>ELECTRICITY</topic><topic>INSULATORS</topic><topic>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</topic><toplevel>online_resources</toplevel><creatorcontrib>CHEN DONG</creatorcontrib><creatorcontrib>WANG LIN</creatorcontrib><creatorcontrib>ZHOU WEI</creatorcontrib><creatorcontrib>WANG WEIDONG</creatorcontrib><creatorcontrib>XU WANGGAN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CHEN DONG</au><au>WANG LIN</au><au>ZHOU WEI</au><au>WANG WEIDONG</au><au>XU WANGGAN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Processing temperature control device for insulating layer pressure board</title><date>2015-03-18</date><risdate>2015</risdate><abstract>The utility model relates to a processing temperature control device for insulating layer pressure boards. The processing temperature control device comprises multiple mutually independent heating plates which all adopts internal control structures. Two ends of each heating plate are communicated with a steam storage tank disposed outside the heating plates. The heating plates and the steam storage tank are connected through air inlet pipelines. A temperature control valve is disposed in each air inlet pipe line. Spoilers are disposed in two end positions inside each heating plate. The length of each spoiler in the radial direction of the heating plate is gradually increased from the end of the heating plate where the spoiler is located to the center position of the heating plate. with the adoption of the processing temperature control device for insulating layer pressure boards disclosed in the technical scheme, steam can go inside the heating plate and spread along the inner wall of the heating plate under the effect of the spoiler, and thus the steam heat can be transferred to the end face of the heating plate faster and the temperature of the heating plate can reach a required temperature rapidly; and accordingly the temperature control efficiency is improved.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng |
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| subjects | BASIC ELECTRIC ELEMENTS CABLES CONDUCTORS ELECTRICITY INSULATORS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES |
| title | Processing temperature control device for insulating layer pressure board |
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