Novel heat conduction material structure
The utility model discloses a novel heat conduction material structure comprising a first layer of heat dissipation coating graphite, a second layer of metal substrate and a third layer of foamed heat absorption coating, wherein the heat dissipation coating graphite comprises 40%-60% of graphite pow...
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creator | WANG ZEYONG LONG TINGTING |
description | The utility model discloses a novel heat conduction material structure comprising a first layer of heat dissipation coating graphite, a second layer of metal substrate and a third layer of foamed heat absorption coating, wherein the heat dissipation coating graphite comprises 40%-60% of graphite powder, 0%-5% of graphene, 10%-20% of ALN and 0%-5% of acrylic acid in percentage by mass; the metal substrate adopts copper foil or aluminum foil; and the heat absorption coating comprises 90%-95% of 0.3micron high-purity SIC powder, 0%-5% of Al2O3 and 0%-5% of Y2O3 in percentage by mass. The heat absorption coating directly clings to a heat source of a backlight module so that heat can be quickly absorbed in short time by the heat absorption coating, then is conducted to the heat dissipation coating by the metal substrate, and is finally dissipated by the heat dissipation coating through heat exchange with air and radiation. Because heat can be quickly absorbed by the heat absorption coating and conducted out by the metal substrate and the heat dissipation coating, the heat dissipation speed is improved by 2-3 times than that with a conventional heat conduction adhesive layer, heat dissipation can be well performed, and the service life of a lamp bead and even the entire module can be prolonged. |
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The heat absorption coating directly clings to a heat source of a backlight module so that heat can be quickly absorbed in short time by the heat absorption coating, then is conducted to the heat dissipation coating by the metal substrate, and is finally dissipated by the heat dissipation coating through heat exchange with air and radiation. Because heat can be quickly absorbed by the heat absorption coating and conducted out by the metal substrate and the heat dissipation coating, the heat dissipation speed is improved by 2-3 times than that with a conventional heat conduction adhesive layer, heat dissipation can be well performed, and the service life of a lamp bead and even the entire module can be prolonged.</description><language>eng</language><subject>LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; PERFORMING OPERATIONS ; TRANSPORTING</subject><creationdate>2015</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20150218&DB=EPODOC&CC=CN&NR=204160826U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25562,76317</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20150218&DB=EPODOC&CC=CN&NR=204160826U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>WANG ZEYONG</creatorcontrib><creatorcontrib>LONG TINGTING</creatorcontrib><title>Novel heat conduction material structure</title><description>The utility model discloses a novel heat conduction material structure comprising a first layer of heat dissipation coating graphite, a second layer of metal substrate and a third layer of foamed heat absorption coating, wherein the heat dissipation coating graphite comprises 40%-60% of graphite powder, 0%-5% of graphene, 10%-20% of ALN and 0%-5% of acrylic acid in percentage by mass; the metal substrate adopts copper foil or aluminum foil; and the heat absorption coating comprises 90%-95% of 0.3micron high-purity SIC powder, 0%-5% of Al2O3 and 0%-5% of Y2O3 in percentage by mass. The heat absorption coating directly clings to a heat source of a backlight module so that heat can be quickly absorbed in short time by the heat absorption coating, then is conducted to the heat dissipation coating by the metal substrate, and is finally dissipated by the heat dissipation coating through heat exchange with air and radiation. Because heat can be quickly absorbed by the heat absorption coating and conducted out by the metal substrate and the heat dissipation coating, the heat dissipation speed is improved by 2-3 times than that with a conventional heat conduction adhesive layer, heat dissipation can be well performed, and the service life of a lamp bead and even the entire module can be prolonged.</description><subject>LAYERED PRODUCTS</subject><subject>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</subject><subject>PERFORMING OPERATIONS</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2015</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNDwyy9LzVHISE0sUUjOz0spTS7JzM9TyE0sSS3KTMxRKC4pAgqVFqXyMLCmJeYUp_JCaW4GJTfXEGcP3dSC_PjU4oLE5NS81JJ4Zz8jAxNDMwMLI7PQUGOiFAEASb0peQ</recordid><startdate>20150218</startdate><enddate>20150218</enddate><creator>WANG ZEYONG</creator><creator>LONG TINGTING</creator><scope>EVB</scope></search><sort><creationdate>20150218</creationdate><title>Novel heat conduction material structure</title><author>WANG ZEYONG ; LONG TINGTING</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN204160826UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2015</creationdate><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>PERFORMING OPERATIONS</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>WANG ZEYONG</creatorcontrib><creatorcontrib>LONG TINGTING</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>WANG ZEYONG</au><au>LONG TINGTING</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Novel heat conduction material structure</title><date>2015-02-18</date><risdate>2015</risdate><abstract>The utility model discloses a novel heat conduction material structure comprising a first layer of heat dissipation coating graphite, a second layer of metal substrate and a third layer of foamed heat absorption coating, wherein the heat dissipation coating graphite comprises 40%-60% of graphite powder, 0%-5% of graphene, 10%-20% of ALN and 0%-5% of acrylic acid in percentage by mass; the metal substrate adopts copper foil or aluminum foil; and the heat absorption coating comprises 90%-95% of 0.3micron high-purity SIC powder, 0%-5% of Al2O3 and 0%-5% of Y2O3 in percentage by mass. The heat absorption coating directly clings to a heat source of a backlight module so that heat can be quickly absorbed in short time by the heat absorption coating, then is conducted to the heat dissipation coating by the metal substrate, and is finally dissipated by the heat dissipation coating through heat exchange with air and radiation. Because heat can be quickly absorbed by the heat absorption coating and conducted out by the metal substrate and the heat dissipation coating, the heat dissipation speed is improved by 2-3 times than that with a conventional heat conduction adhesive layer, heat dissipation can be well performed, and the service life of a lamp bead and even the entire module can be prolonged.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PERFORMING OPERATIONS TRANSPORTING |
title | Novel heat conduction material structure |
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