Grinding device
The utility model discloses a grinding device which comprises a grinding head, a rotation mechanism fixed on the grinding head, and a grinding pad arranged under the grinding head. The grinding head comprises a first baffle and a second baffle connected with the first baffle through a ball. The ball...
Gespeichert in:
| Hauptverfasser: | , , |
|---|---|
| Format: | Patent |
| Sprache: | chi ; eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | TANG JINGJI ZHANG HENGHUI HU JIE |
| description | The utility model discloses a grinding device which comprises a grinding head, a rotation mechanism fixed on the grinding head, and a grinding pad arranged under the grinding head. The grinding head comprises a first baffle and a second baffle connected with the first baffle through a ball. The ball is arranged between the first baffle and the second baffle of the grinding head, so that the first baffle and the second baffle are not in direct contact, when chemical mechanical grinding is carried out and the rotation mechanism fixed on the grinding head exerts uneven pressure on the grinding head, only the included angle between the second baffle and the horizontal plane is changed, the first baffle and the grinding pad still keep tight contact, and flatness of wafers and subsequent product yield are improved. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN203918738UU</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN203918738UU</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN203918738UU3</originalsourceid><addsrcrecordid>eNrjZOB3L8rMS8nMS1dISS3LTE7lYWBNS8wpTuWF0twMSm6uIc4euqkF-fGpxQWJyal5qSXxzn5GBsaWhhbmxhahocZEKQIAu7Ifng</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Grinding device</title><source>esp@cenet</source><creator>TANG JINGJI ; ZHANG HENGHUI ; HU JIE</creator><creatorcontrib>TANG JINGJI ; ZHANG HENGHUI ; HU JIE</creatorcontrib><description>The utility model discloses a grinding device which comprises a grinding head, a rotation mechanism fixed on the grinding head, and a grinding pad arranged under the grinding head. The grinding head comprises a first baffle and a second baffle connected with the first baffle through a ball. The ball is arranged between the first baffle and the second baffle of the grinding head, so that the first baffle and the second baffle are not in direct contact, when chemical mechanical grinding is carried out and the rotation mechanism fixed on the grinding head exerts uneven pressure on the grinding head, only the included angle between the second baffle and the horizontal plane is changed, the first baffle and the grinding pad still keep tight contact, and flatness of wafers and subsequent product yield are improved.</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; DRESSING OR CONDITIONING OF ABRADING SURFACES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; PERFORMING OPERATIONS ; POLISHING ; SEMICONDUCTOR DEVICES ; TRANSPORTING</subject><creationdate>2014</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20141105&DB=EPODOC&CC=CN&NR=203918738U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20141105&DB=EPODOC&CC=CN&NR=203918738U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TANG JINGJI</creatorcontrib><creatorcontrib>ZHANG HENGHUI</creatorcontrib><creatorcontrib>HU JIE</creatorcontrib><title>Grinding device</title><description>The utility model discloses a grinding device which comprises a grinding head, a rotation mechanism fixed on the grinding head, and a grinding pad arranged under the grinding head. The grinding head comprises a first baffle and a second baffle connected with the first baffle through a ball. The ball is arranged between the first baffle and the second baffle of the grinding head, so that the first baffle and the second baffle are not in direct contact, when chemical mechanical grinding is carried out and the rotation mechanism fixed on the grinding head exerts uneven pressure on the grinding head, only the included angle between the second baffle and the horizontal plane is changed, the first baffle and the grinding pad still keep tight contact, and flatness of wafers and subsequent product yield are improved.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GRINDING</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHING</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2014</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZOB3L8rMS8nMS1dISS3LTE7lYWBNS8wpTuWF0twMSm6uIc4euqkF-fGpxQWJyal5qSXxzn5GBsaWhhbmxhahocZEKQIAu7Ifng</recordid><startdate>20141105</startdate><enddate>20141105</enddate><creator>TANG JINGJI</creator><creator>ZHANG HENGHUI</creator><creator>HU JIE</creator><scope>EVB</scope></search><sort><creationdate>20141105</creationdate><title>Grinding device</title><author>TANG JINGJI ; ZHANG HENGHUI ; HU JIE</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN203918738UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2014</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>GRINDING</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHING</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>TANG JINGJI</creatorcontrib><creatorcontrib>ZHANG HENGHUI</creatorcontrib><creatorcontrib>HU JIE</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TANG JINGJI</au><au>ZHANG HENGHUI</au><au>HU JIE</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Grinding device</title><date>2014-11-05</date><risdate>2014</risdate><abstract>The utility model discloses a grinding device which comprises a grinding head, a rotation mechanism fixed on the grinding head, and a grinding pad arranged under the grinding head. The grinding head comprises a first baffle and a second baffle connected with the first baffle through a ball. The ball is arranged between the first baffle and the second baffle of the grinding head, so that the first baffle and the second baffle are not in direct contact, when chemical mechanical grinding is carried out and the rotation mechanism fixed on the grinding head exerts uneven pressure on the grinding head, only the included angle between the second baffle and the horizontal plane is changed, the first baffle and the grinding pad still keep tight contact, and flatness of wafers and subsequent product yield are improved.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | chi ; eng |
| recordid | cdi_epo_espacenet_CN203918738UU |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING |
| title | Grinding device |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-30T05%3A46%3A42IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=TANG%20JINGJI&rft.date=2014-11-05&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN203918738UU%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |