Surface treatment device for high-density interconnection printed circuit board

Provided is a surface treatment device for a high-density interconnection printed circuit board. The surface treatment device comprises a high-frequency power supply, heating pipes, a base plate, rolling shafts and an integration board. The characteristics of the surface treatment device are that: t...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	DAI CHENGHAO, FANG YUMEI, WU LUOWEI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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