Surface treatment device for high-density interconnection printed circuit board
Provided is a surface treatment device for a high-density interconnection printed circuit board. The surface treatment device comprises a high-frequency power supply, heating pipes, a base plate, rolling shafts and an integration board. The characteristics of the surface treatment device are that: t...
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| creator | DAI CHENGHAO FANG YUMEI WU LUOWEI |
| description | Provided is a surface treatment device for a high-density interconnection printed circuit board. The surface treatment device comprises a high-frequency power supply, heating pipes, a base plate, rolling shafts and an integration board. The characteristics of the surface treatment device are that: the rolling shafts are arranged on the base plate, and a printed circuit board substrate is disposed on the rolling shafts; when the rolling shafts rotate, the printed circuit board substrate moves to one side of the base plate; the integration board is placed on the printed circuit board substrate, and the heating pipes are arranged on the integration board and are connected with the high-frequency power supply; multiple through storage holes are distributed densely in the integration board, and insulation resin is placed in the through storage holes; and the interlayer of the integration board is a heating layer which is connected with the high-frequency power supply. The beneficial effects of the surface treatment device are that: by using a method of fusing heat insulation resin, an insulation resin layer coats the surface of the printed circuit board, so that the surface of the printed circuit board substrate maintains insulation, and the yield of the printed circuit board is improved. |
| format | Patent |
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The surface treatment device comprises a high-frequency power supply, heating pipes, a base plate, rolling shafts and an integration board. The characteristics of the surface treatment device are that: the rolling shafts are arranged on the base plate, and a printed circuit board substrate is disposed on the rolling shafts; when the rolling shafts rotate, the printed circuit board substrate moves to one side of the base plate; the integration board is placed on the printed circuit board substrate, and the heating pipes are arranged on the integration board and are connected with the high-frequency power supply; multiple through storage holes are distributed densely in the integration board, and insulation resin is placed in the through storage holes; and the interlayer of the integration board is a heating layer which is connected with the high-frequency power supply. The beneficial effects of the surface treatment device are that: by using a method of fusing heat insulation resin, an insulation resin layer coats the surface of the printed circuit board, so that the surface of the printed circuit board substrate maintains insulation, and the yield of the printed circuit board is improved.</description><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2014</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20141022&DB=EPODOC&CC=CN&NR=203896604U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20141022&DB=EPODOC&CC=CN&NR=203896604U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>DAI CHENGHAO</creatorcontrib><creatorcontrib>FANG YUMEI</creatorcontrib><creatorcontrib>WU LUOWEI</creatorcontrib><title>Surface treatment device for high-density interconnection printed circuit board</title><description>Provided is a surface treatment device for a high-density interconnection printed circuit board. The surface treatment device comprises a high-frequency power supply, heating pipes, a base plate, rolling shafts and an integration board. The characteristics of the surface treatment device are that: the rolling shafts are arranged on the base plate, and a printed circuit board substrate is disposed on the rolling shafts; when the rolling shafts rotate, the printed circuit board substrate moves to one side of the base plate; the integration board is placed on the printed circuit board substrate, and the heating pipes are arranged on the integration board and are connected with the high-frequency power supply; multiple through storage holes are distributed densely in the integration board, and insulation resin is placed in the through storage holes; and the interlayer of the integration board is a heating layer which is connected with the high-frequency power supply. The beneficial effects of the surface treatment device are that: by using a method of fusing heat insulation resin, an insulation resin layer coats the surface of the printed circuit board, so that the surface of the printed circuit board substrate maintains insulation, and the yield of the printed circuit board is improved.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2014</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjbEKwjAQQLM4iPoPh3uhWCk6F8VJB-1cYnJpD_QSLlfBv7eCH-D04PHgzc3lOkqwDkEFrT6RFTy-aBIhCgzUD4VHzqRvIFYUF5nRKUWGJF_jwZG4kRTu0Ypfmlmwj4yrHxdmfTzcmlOBKXaY07Ri1K45b8pqt6_rctu21V_RByFwOHo</recordid><startdate>20141022</startdate><enddate>20141022</enddate><creator>DAI CHENGHAO</creator><creator>FANG YUMEI</creator><creator>WU LUOWEI</creator><scope>EVB</scope></search><sort><creationdate>20141022</creationdate><title>Surface treatment device for high-density interconnection printed circuit board</title><author>DAI CHENGHAO ; FANG YUMEI ; WU LUOWEI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN203896604UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2014</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>DAI CHENGHAO</creatorcontrib><creatorcontrib>FANG YUMEI</creatorcontrib><creatorcontrib>WU LUOWEI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>DAI CHENGHAO</au><au>FANG YUMEI</au><au>WU LUOWEI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Surface treatment device for high-density interconnection printed circuit board</title><date>2014-10-22</date><risdate>2014</risdate><abstract>Provided is a surface treatment device for a high-density interconnection printed circuit board. The surface treatment device comprises a high-frequency power supply, heating pipes, a base plate, rolling shafts and an integration board. The characteristics of the surface treatment device are that: the rolling shafts are arranged on the base plate, and a printed circuit board substrate is disposed on the rolling shafts; when the rolling shafts rotate, the printed circuit board substrate moves to one side of the base plate; the integration board is placed on the printed circuit board substrate, and the heating pipes are arranged on the integration board and are connected with the high-frequency power supply; multiple through storage holes are distributed densely in the integration board, and insulation resin is placed in the through storage holes; and the interlayer of the integration board is a heating layer which is connected with the high-frequency power supply. The beneficial effects of the surface treatment device are that: by using a method of fusing heat insulation resin, an insulation resin layer coats the surface of the printed circuit board, so that the surface of the printed circuit board substrate maintains insulation, and the yield of the printed circuit board is improved.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | Surface treatment device for high-density interconnection printed circuit board |
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