Silicon wafer polishing apparatus for localized heating

The utility model provides a silicon wafer polishing apparatus for localized heating. The silicon wafer polishing apparatus includes a roller, a heating modulator tube, a reflector, a sensor, a tank body and so on. According to the utility model, the silicon wafer polishing apparatus is reasonable in structure and simple in construction, and compared with a polishing apparatus heating liquid in the entire groove, the silicon wafer polishing apparatus, thanks to the use of the design of localized heating, is advantageous in that: only the place where a silicon wafer is positioned is heated, and the heating is automatically stopped when no silicon wafer exists, and therefore the power consumption is lower and equipment cost is saved; and as the liquid temperature at non-heating positions are relatively low, higher cost performance materials can be selected for manufacturing the tank body in design, and the manufacturing cost of equipment is saved.