LED lamp high in heat dissipation performance
The utility model discloses an LED lamp high in heat dissipation performance. The LED lamp comprises a lampshade, a thermal conductive plate, a radiator and an LED chip, wherein the radiator is installed on the lampshade, the thermal conductive plate is installed in a reflective cover, one side of t...
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| creator | LI WENBO MIAO YONGBIN ZOU JUN |
| description | The utility model discloses an LED lamp high in heat dissipation performance. The LED lamp comprises a lampshade, a thermal conductive plate, a radiator and an LED chip, wherein the radiator is installed on the lampshade, the thermal conductive plate is installed in a reflective cover, one side of the thermal conductive plate is connected with the radiator, the LED chip is installed on the other side of the thermal conductive plate, and the LED chip comprises a first support, a second support, adhesive with electrical conductivity, a PN joint, a sapphire and fluorescent powder. The LED lamp is characterized in that the first support and the second support serve as a P-type semiconductor and an N-type semiconductor respectively, the near end of the first support and the near end of the second support are coated with the adhesive with electrical conductivity, the two ends of the bottom of the PN joint are connected with the first support and the second support through the adhesive with electrical conductivity r |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN203836684UU</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN203836684UU</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN203836684UU3</originalsourceid><addsrcrecordid>eNrjZND1cXVRyEnMLVDIyEzPUMjMU8hITSxRSMksLs4sSCzJzM9TKEgtSssvyk3MS07lYWBNS8wpTuWF0twMSm6uIc4euqkF-fGpxQWJyal5qSXxzn5GBsYWxmZmFiahocZEKQIA1jYqiQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>LED lamp high in heat dissipation performance</title><source>esp@cenet</source><creator>LI WENBO ; MIAO YONGBIN ; ZOU JUN</creator><creatorcontrib>LI WENBO ; MIAO YONGBIN ; ZOU JUN</creatorcontrib><description>The utility model discloses an LED lamp high in heat dissipation performance. The LED lamp comprises a lampshade, a thermal conductive plate, a radiator and an LED chip, wherein the radiator is installed on the lampshade, the thermal conductive plate is installed in a reflective cover, one side of the thermal conductive plate is connected with the radiator, the LED chip is installed on the other side of the thermal conductive plate, and the LED chip comprises a first support, a second support, adhesive with electrical conductivity, a PN joint, a sapphire and fluorescent powder. The LED lamp is characterized in that the first support and the second support serve as a P-type semiconductor and an N-type semiconductor respectively, the near end of the first support and the near end of the second support are coated with the adhesive with electrical conductivity, the two ends of the bottom of the PN joint are connected with the first support and the second support through the adhesive with electrical conductivity r</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; BLASTING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF ; HEATING ; INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21Sand F21V, RELATING TO THEFORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THELIGHT EMITTED ; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR ; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL ; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE ; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATINGELEMENTS ; LIGHTING ; MECHANICAL ENGINEERING ; NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE ; SEMICONDUCTOR DEVICES ; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR ; WEAPONS</subject><creationdate>2014</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20140917&DB=EPODOC&CC=CN&NR=203836684U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20140917&DB=EPODOC&CC=CN&NR=203836684U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LI WENBO</creatorcontrib><creatorcontrib>MIAO YONGBIN</creatorcontrib><creatorcontrib>ZOU JUN</creatorcontrib><title>LED lamp high in heat dissipation performance</title><description>The utility model discloses an LED lamp high in heat dissipation performance. The LED lamp comprises a lampshade, a thermal conductive plate, a radiator and an LED chip, wherein the radiator is installed on the lampshade, the thermal conductive plate is installed in a reflective cover, one side of the thermal conductive plate is connected with the radiator, the LED chip is installed on the other side of the thermal conductive plate, and the LED chip comprises a first support, a second support, adhesive with electrical conductivity, a PN joint, a sapphire and fluorescent powder. The LED lamp is characterized in that the first support and the second support serve as a P-type semiconductor and an N-type semiconductor respectively, the near end of the first support and the near end of the second support are coated with the adhesive with electrical conductivity, the two ends of the bottom of the PN joint are connected with the first support and the second support through the adhesive with electrical conductivity r</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>BLASTING</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF</subject><subject>HEATING</subject><subject>INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21Sand F21V, RELATING TO THEFORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THELIGHT EMITTED</subject><subject>LIGHT SOURCES NOT OTHERWISE PROVIDED FOR</subject><subject>LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL</subject><subject>LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE</subject><subject>LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATINGELEMENTS</subject><subject>LIGHTING</subject><subject>MECHANICAL ENGINEERING</subject><subject>NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR</subject><subject>WEAPONS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2014</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZND1cXVRyEnMLVDIyEzPUMjMU8hITSxRSMksLs4sSCzJzM9TKEgtSssvyk3MS07lYWBNS8wpTuWF0twMSm6uIc4euqkF-fGpxQWJyal5qSXxzn5GBsYWxmZmFiahocZEKQIA1jYqiQ</recordid><startdate>20140917</startdate><enddate>20140917</enddate><creator>LI WENBO</creator><creator>MIAO YONGBIN</creator><creator>ZOU JUN</creator><scope>EVB</scope></search><sort><creationdate>20140917</creationdate><title>LED lamp high in heat dissipation performance</title><author>LI WENBO ; MIAO YONGBIN ; ZOU JUN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN203836684UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2014</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>BLASTING</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF</topic><topic>HEATING</topic><topic>INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21Sand F21V, RELATING TO THEFORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THELIGHT EMITTED</topic><topic>LIGHT SOURCES NOT OTHERWISE PROVIDED FOR</topic><topic>LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL</topic><topic>LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE</topic><topic>LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATINGELEMENTS</topic><topic>LIGHTING</topic><topic>MECHANICAL ENGINEERING</topic><topic>NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR</topic><topic>WEAPONS</topic><toplevel>online_resources</toplevel><creatorcontrib>LI WENBO</creatorcontrib><creatorcontrib>MIAO YONGBIN</creatorcontrib><creatorcontrib>ZOU JUN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LI WENBO</au><au>MIAO YONGBIN</au><au>ZOU JUN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>LED lamp high in heat dissipation performance</title><date>2014-09-17</date><risdate>2014</risdate><abstract>The utility model discloses an LED lamp high in heat dissipation performance. The LED lamp comprises a lampshade, a thermal conductive plate, a radiator and an LED chip, wherein the radiator is installed on the lampshade, the thermal conductive plate is installed in a reflective cover, one side of the thermal conductive plate is connected with the radiator, the LED chip is installed on the other side of the thermal conductive plate, and the LED chip comprises a first support, a second support, adhesive with electrical conductivity, a PN joint, a sapphire and fluorescent powder. The LED lamp is characterized in that the first support and the second support serve as a P-type semiconductor and an N-type semiconductor respectively, the near end of the first support and the near end of the second support are coated with the adhesive with electrical conductivity, the two ends of the bottom of the PN joint are connected with the first support and the second support through the adhesive with electrical conductivity r</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS BLASTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF HEATING INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21Sand F21V, RELATING TO THEFORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THELIGHT EMITTED LIGHT SOURCES NOT OTHERWISE PROVIDED FOR LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATINGELEMENTS LIGHTING MECHANICAL ENGINEERING NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE SEMICONDUCTOR DEVICES STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR WEAPONS |
| title | LED lamp high in heat dissipation performance |
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