Voltage reduction and heat dissipation-integrated silicon chain module

Voltage reduction and heat dissipation-integrated silicon chain module

The utility model discloses a voltage reduction and heat dissipation-integrated silicon chain module, which comprises a plurality of diode chips, an aluminum-based copper-clad board and a radiator, wherein the diode chips is welded on the aluminum-based copper-clad board in a first parallel connecti...

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Hauptverfasser: SONG CHANG'AN, FU ZILIN
Format: Patent
Sprache:chi ; eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator SONG CHANG'AN
FU ZILIN
description The utility model discloses a voltage reduction and heat dissipation-integrated silicon chain module, which comprises a plurality of diode chips, an aluminum-based copper-clad board and a radiator, wherein the diode chips is welded on the aluminum-based copper-clad board in a first parallel connection and then serial connection mode to form a silicon chain; taps are led out from the serial nodes of the diode chips of the silicon chain; and the aluminum-based copper-clad board is installed on the radiator. According to the voltage reduction and heat dissipation-integrated silicon chain module, the contact surface between the diode chips and the aluminum-based copper-clad board is not oxidized, loosening is not likely to happen, and the performances are reliable; and the voltage reduction and heat dissipation-integrated silicon chain module has the advantages of low cost, good heat dissipation effect, safe use, and convenient installation.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Voltage reduction and heat dissipation-integrated silicon chain module
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