Automatic alarm device for liquid level of plating bath for steel band copper plating

Automatic alarm device for liquid level of plating bath for steel band copper plating

The utility model provides an automatic alarm device for the liquid level of a plating bath for steel band copper plating. The automatic alarm device comprises a buoy, a light connecting wire, a pressure sensor, an automatic alarm and a lead wire, wherein the buoy is connected with the light connect...

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Hauptverfasser: YU HAIQUAN, XIE DEYANG, SHI LEI, JIANG NEMIN, WANG FANYU, WANG CHENGCHAO
Format: Patent
Sprache:chi ; eng
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APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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creator YU HAIQUAN
XIE DEYANG
SHI LEI
JIANG NEMIN
WANG FANYU
WANG CHENGCHAO
description The utility model provides an automatic alarm device for the liquid level of a plating bath for steel band copper plating. The automatic alarm device comprises a buoy, a light connecting wire, a pressure sensor, an automatic alarm and a lead wire, wherein the buoy is connected with the light connecting wire; the light connecting wire is connected with the pressure sensor; the pressure sensor is connected with the lead wire; the lead wire is connected with the automatic alarm. When liquid in the plating bath exceeds a warning liquid level, due to the action of buoyancy, the buoy applies pulling force to the pressure sensor through the light connecting wire, at this time, the pressure sensor sends out a signal, the signal is transmitted to the automatic alarm device through the lead wire, and the automatic alarm device gives an alarm to remind producers that the liquid level of the plating bath is too high.
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subjects APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
title Automatic alarm device for liquid level of plating bath for steel band copper plating
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