Light emitting diode
The utility model discloses a light emitting diode. The light emitting diode comprises a substrate, an LED chip arranged on the substrate and a second glue layer filled around the LED chip and further comprises at least one of a third printing glue layer covered the second glue layer, wherein the th...
Gespeichert in:
Hauptverfasser: | , , |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
container_end_page | |
---|---|
container_issue | |
container_start_page | |
container_title | |
container_volume | |
creator | SUN PINGRU MA MINGLAI WEI JIANHUA |
description | The utility model discloses a light emitting diode. The light emitting diode comprises a substrate, an LED chip arranged on the substrate and a second glue layer filled around the LED chip and further comprises at least one of a third printing glue layer covered the second glue layer, wherein the third printing glue layer is a second fluorescent glue layer. The second fluorescent glue layer of the LED is printed on a surface of the second fluorescent glue layer, namely, a luminescence face of the LED chip, and a fluorescent glue layer is formed by printing, so position of fluorescent powder at fluorescent glue is relatively fixed, and distribution of the fluorescent powder at the fluorescent glue is more uniform than position distribution of fluorescent powder at fluorescent glue in the prior art, and thereby uniformity of LED luminescence color is improved, moreover, only arrangement of the fluorescent glue layer on the luminescence face of the LED chip is required, and the fluorescent glue is not filled in |
format | Patent |
fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN202712262UU</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN202712262UU</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN202712262UU3</originalsourceid><addsrcrecordid>eNrjZBDxyUzPKFFIzc0sKcnMS1dIycxPSeVhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfHOfkYGRuaGRkZmRqGhxkQpAgCD6SFd</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Light emitting diode</title><source>esp@cenet</source><creator>SUN PINGRU ; MA MINGLAI ; WEI JIANHUA</creator><creatorcontrib>SUN PINGRU ; MA MINGLAI ; WEI JIANHUA</creatorcontrib><description>The utility model discloses a light emitting diode. The light emitting diode comprises a substrate, an LED chip arranged on the substrate and a second glue layer filled around the LED chip and further comprises at least one of a third printing glue layer covered the second glue layer, wherein the third printing glue layer is a second fluorescent glue layer. The second fluorescent glue layer of the LED is printed on a surface of the second fluorescent glue layer, namely, a luminescence face of the LED chip, and a fluorescent glue layer is formed by printing, so position of fluorescent powder at fluorescent glue is relatively fixed, and distribution of the fluorescent powder at the fluorescent glue is more uniform than position distribution of fluorescent powder at fluorescent glue in the prior art, and thereby uniformity of LED luminescence color is improved, moreover, only arrangement of the fluorescent glue layer on the luminescence face of the LED chip is required, and the fluorescent glue is not filled in</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2013</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20130130&DB=EPODOC&CC=CN&NR=202712262U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20130130&DB=EPODOC&CC=CN&NR=202712262U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SUN PINGRU</creatorcontrib><creatorcontrib>MA MINGLAI</creatorcontrib><creatorcontrib>WEI JIANHUA</creatorcontrib><title>Light emitting diode</title><description>The utility model discloses a light emitting diode. The light emitting diode comprises a substrate, an LED chip arranged on the substrate and a second glue layer filled around the LED chip and further comprises at least one of a third printing glue layer covered the second glue layer, wherein the third printing glue layer is a second fluorescent glue layer. The second fluorescent glue layer of the LED is printed on a surface of the second fluorescent glue layer, namely, a luminescence face of the LED chip, and a fluorescent glue layer is formed by printing, so position of fluorescent powder at fluorescent glue is relatively fixed, and distribution of the fluorescent powder at the fluorescent glue is more uniform than position distribution of fluorescent powder at fluorescent glue in the prior art, and thereby uniformity of LED luminescence color is improved, moreover, only arrangement of the fluorescent glue layer on the luminescence face of the LED chip is required, and the fluorescent glue is not filled in</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2013</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBDxyUzPKFFIzc0sKcnMS1dIycxPSeVhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfHOfkYGRuaGRkZmRqGhxkQpAgCD6SFd</recordid><startdate>20130130</startdate><enddate>20130130</enddate><creator>SUN PINGRU</creator><creator>MA MINGLAI</creator><creator>WEI JIANHUA</creator><scope>EVB</scope></search><sort><creationdate>20130130</creationdate><title>Light emitting diode</title><author>SUN PINGRU ; MA MINGLAI ; WEI JIANHUA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN202712262UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2013</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>SUN PINGRU</creatorcontrib><creatorcontrib>MA MINGLAI</creatorcontrib><creatorcontrib>WEI JIANHUA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SUN PINGRU</au><au>MA MINGLAI</au><au>WEI JIANHUA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Light emitting diode</title><date>2013-01-30</date><risdate>2013</risdate><abstract>The utility model discloses a light emitting diode. The light emitting diode comprises a substrate, an LED chip arranged on the substrate and a second glue layer filled around the LED chip and further comprises at least one of a third printing glue layer covered the second glue layer, wherein the third printing glue layer is a second fluorescent glue layer. The second fluorescent glue layer of the LED is printed on a surface of the second fluorescent glue layer, namely, a luminescence face of the LED chip, and a fluorescent glue layer is formed by printing, so position of fluorescent powder at fluorescent glue is relatively fixed, and distribution of the fluorescent powder at the fluorescent glue is more uniform than position distribution of fluorescent powder at fluorescent glue in the prior art, and thereby uniformity of LED luminescence color is improved, moreover, only arrangement of the fluorescent glue layer on the luminescence face of the LED chip is required, and the fluorescent glue is not filled in</abstract><oa>free_for_read</oa></addata></record> |
fulltext | fulltext_linktorsrc |
identifier | |
ispartof | |
issn | |
language | chi ; eng |
recordid | cdi_epo_espacenet_CN202712262UU |
source | esp@cenet |
subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
title | Light emitting diode |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-05T21%3A32%3A08IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=SUN%20PINGRU&rft.date=2013-01-30&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN202712262UU%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |