Wall thickness reduction device for thin wall metal hemisphere
The utility model discloses a wall thickness reduction device for a thin wall metal hemisphere. The wall thickness reduction device comprises a support, a glazing machine and a fixing mechanism, wherein the support is arranged above a base of a lathe, the glazing machine is fixedly arranged at the u...
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| creator | GUO PING LIU WEI LEI WENGUANG QI YUNLIAN HONG QUAN LU YAFENG |
| description | The utility model discloses a wall thickness reduction device for a thin wall metal hemisphere. The wall thickness reduction device comprises a support, a glazing machine and a fixing mechanism, wherein the support is arranged above a base of a lathe, the glazing machine is fixedly arranged at the upper end of the support, the fixing mechanism is used for fixing the metal hemisphere to be thinned down, a sliding chute is fixedly arranged on the base of the lathe, the support is arranged at the rear end of the base of the lathe and consists of the base and a rack body fixedly arranged on the base, a guide rail which is matched with the sliding chute for use is arranged at the lower end of the base, and a limiting piece for limiting the base is arranged on the base; the glazing machine comprises a handle fixedly arranged at the upper end of the rack body, a polishing wheel is fixedly arranged at the front end of the handle and is contacted with the metal hemisphere to be thinned down; and the fixing mechanism i |
| format | Patent |
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The wall thickness reduction device comprises a support, a glazing machine and a fixing mechanism, wherein the support is arranged above a base of a lathe, the glazing machine is fixedly arranged at the upper end of the support, the fixing mechanism is used for fixing the metal hemisphere to be thinned down, a sliding chute is fixedly arranged on the base of the lathe, the support is arranged at the rear end of the base of the lathe and consists of the base and a rack body fixedly arranged on the base, a guide rail which is matched with the sliding chute for use is arranged at the lower end of the base, and a limiting piece for limiting the base is arranged on the base; the glazing machine comprises a handle fixedly arranged at the upper end of the rack body, a polishing wheel is fixedly arranged at the front end of the handle and is contacted with the metal hemisphere to be thinned down; and the fixing mechanism i</description><language>chi ; eng</language><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; PERFORMING OPERATIONS ; POLISHING ; TRANSPORTING</subject><creationdate>2012</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20120328&DB=EPODOC&CC=CN&NR=202174465U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20120328&DB=EPODOC&CC=CN&NR=202174465U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>GUO PING</creatorcontrib><creatorcontrib>LIU WEI</creatorcontrib><creatorcontrib>LEI WENGUANG</creatorcontrib><creatorcontrib>QI YUNLIAN</creatorcontrib><creatorcontrib>HONG QUAN</creatorcontrib><creatorcontrib>LU YAFENG</creatorcontrib><title>Wall thickness reduction device for thin wall metal hemisphere</title><description>The utility model discloses a wall thickness reduction device for a thin wall metal hemisphere. The wall thickness reduction device comprises a support, a glazing machine and a fixing mechanism, wherein the support is arranged above a base of a lathe, the glazing machine is fixedly arranged at the upper end of the support, the fixing mechanism is used for fixing the metal hemisphere to be thinned down, a sliding chute is fixedly arranged on the base of the lathe, the support is arranged at the rear end of the base of the lathe and consists of the base and a rack body fixedly arranged on the base, a guide rail which is matched with the sliding chute for use is arranged at the lower end of the base, and a limiting piece for limiting the base is arranged on the base; the glazing machine comprises a handle fixedly arranged at the upper end of the rack body, a polishing wheel is fixedly arranged at the front end of the handle and is contacted with the metal hemisphere to be thinned down; and the fixing mechanism i</description><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GRINDING</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHING</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2012</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLALT8zJUSjJyEzOzkstLlYoSk0pTS7JzM9TSEkty0xOVUjLLwJJ5ymUgxTmppYk5ihkpOZmFhdkpBal8jCwpiXmFKfyQmluBiU31xBnD93Ugvz41OKCxOTUvNSSeGc_IwMjQ3MTEzPT0FBjohQBAMvaMXc</recordid><startdate>20120328</startdate><enddate>20120328</enddate><creator>GUO PING</creator><creator>LIU WEI</creator><creator>LEI WENGUANG</creator><creator>QI YUNLIAN</creator><creator>HONG QUAN</creator><creator>LU YAFENG</creator><scope>EVB</scope></search><sort><creationdate>20120328</creationdate><title>Wall thickness reduction device for thin wall metal hemisphere</title><author>GUO PING ; LIU WEI ; LEI WENGUANG ; QI YUNLIAN ; HONG QUAN ; LU YAFENG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN202174465UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2012</creationdate><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>GRINDING</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHING</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>GUO PING</creatorcontrib><creatorcontrib>LIU WEI</creatorcontrib><creatorcontrib>LEI WENGUANG</creatorcontrib><creatorcontrib>QI YUNLIAN</creatorcontrib><creatorcontrib>HONG QUAN</creatorcontrib><creatorcontrib>LU YAFENG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>GUO PING</au><au>LIU WEI</au><au>LEI WENGUANG</au><au>QI YUNLIAN</au><au>HONG QUAN</au><au>LU YAFENG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Wall thickness reduction device for thin wall metal hemisphere</title><date>2012-03-28</date><risdate>2012</risdate><abstract>The utility model discloses a wall thickness reduction device for a thin wall metal hemisphere. The wall thickness reduction device comprises a support, a glazing machine and a fixing mechanism, wherein the support is arranged above a base of a lathe, the glazing machine is fixedly arranged at the upper end of the support, the fixing mechanism is used for fixing the metal hemisphere to be thinned down, a sliding chute is fixedly arranged on the base of the lathe, the support is arranged at the rear end of the base of the lathe and consists of the base and a rack body fixedly arranged on the base, a guide rail which is matched with the sliding chute for use is arranged at the lower end of the base, and a limiting piece for limiting the base is arranged on the base; the glazing machine comprises a handle fixedly arranged at the upper end of the rack body, a polishing wheel is fixedly arranged at the front end of the handle and is contacted with the metal hemisphere to be thinned down; and the fixing mechanism i</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TRANSPORTING |
| title | Wall thickness reduction device for thin wall metal hemisphere |
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