Electroplating device for lead wire frame

Electroplating device for lead wire frame

The utility model discloses an electroplating device for a lead wire frame, which sequentially comprises an injection plate, an anode plate, a substrate and a masking base plate from bottom to top. A plurality of electroplating through holes are distributed on the masking base plate in array mode an...

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Hauptverfasser: SU YUELAI, WANG FENGTAO, LIN GUIXIAN, WANG KANG, LI NANSHENG
Format: Patent
Sprache:chi ; eng
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APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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creator SU YUELAI
WANG FENGTAO
LIN GUIXIAN
WANG KANG
LI NANSHENG
description The utility model discloses an electroplating device for a lead wire frame, which sequentially comprises an injection plate, an anode plate, a substrate and a masking base plate from bottom to top. A plurality of electroplating through holes are distributed on the masking base plate in array mode and respectively corresponds to electroplating unit areas on the lead wire frame. Electroplating operation on the lead wire frame can be finished by means of the injection plate and an electroplating liquid injecting loop on the anode plate by one step. Electroplating liquid is injected to an injection flow channel and electroplated to a pad area on the lead wire frame, and all the electroplating unit areas can be electroplated by one step. Furthermore, the electroplating uniformity is good, and electroplating quality is high. Electroplating waste liquid is collected by a loop flow channel, and an injection path of the electroplating liquid is not influenced. The electroplating device for the lead wire frame is parti
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A plurality of electroplating through holes are distributed on the masking base plate in array mode and respectively corresponds to electroplating unit areas on the lead wire frame. Electroplating operation on the lead wire frame can be finished by means of the injection plate and an electroplating liquid injecting loop on the anode plate by one step. Electroplating liquid is injected to an injection flow channel and electroplated to a pad area on the lead wire frame, and all the electroplating unit areas can be electroplated by one step. Furthermore, the electroplating uniformity is good, and electroplating quality is high. Electroplating waste liquid is collected by a loop flow channel, and an injection path of the electroplating liquid is not influenced. 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subjects APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
title Electroplating device for lead wire frame
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