Selective electroplating fixture for valve automatic line
The utility model relates to a selective electroplating fixture for a valve automatic line, which is mainly formed by a movable cathode assembly, an anode assembly and an adjusting lower valve positioning assembly, wherein the movable cathode assembly consists of a cathode cylinder, a cathode fixing...
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creator | ZHENG XIAOYUAN CHEN GANG LUO JIANDONG LIAO SHILEI DENG JIANXIONG LU JIECHU LUO PENG HUANG LIXUN LI QU NING ZHIJIAN |
description | The utility model relates to a selective electroplating fixture for a valve automatic line, which is mainly formed by a movable cathode assembly, an anode assembly and an adjusting lower valve positioning assembly, wherein the movable cathode assembly consists of a cathode cylinder, a cathode fixing plate and an elastic electroplating cathode; the anode assembly consists of a support, an anode fixing plate, an electroplating anode and an upper valve positioning piece; and the adjusting lower valve positioning assembly consists of a lower positioning cylinder, a lower positioning plate and a lower valve positioning piece. Since an electroplating profiling anode and an elastic cathode are adopted, thirty-six independent small power supplies are used to respectively supply power to thirty-six corresponding valves, and the upper valve positioning piece and the lower valve positioning piece are used for shielding the parts not to be plated of the valves, the consistency of the bottom application length and the pla |
format | Patent |
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Since an electroplating profiling anode and an elastic cathode are adopted, thirty-six independent small power supplies are used to respectively supply power to thirty-six corresponding valves, and the upper valve positioning piece and the lower valve positioning piece are used for shielding the parts not to be plated of the valves, the consistency of the bottom application length and the pla</description><language>chi ; eng</language><subject>APPARATUS THEREFOR ; CHEMISTRY ; ELECTROFORMING ; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ; METALLURGY ; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><creationdate>2010</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20101117&DB=EPODOC&CC=CN&NR=201634789U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20101117&DB=EPODOC&CC=CN&NR=201634789U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ZHENG XIAOYUAN</creatorcontrib><creatorcontrib>CHEN GANG</creatorcontrib><creatorcontrib>LUO JIANDONG</creatorcontrib><creatorcontrib>LIAO SHILEI</creatorcontrib><creatorcontrib>DENG JIANXIONG</creatorcontrib><creatorcontrib>LU JIECHU</creatorcontrib><creatorcontrib>LUO PENG</creatorcontrib><creatorcontrib>HUANG LIXUN</creatorcontrib><creatorcontrib>LI QU</creatorcontrib><creatorcontrib>NING ZHIJIAN</creatorcontrib><title>Selective electroplating fixture for valve automatic line</title><description>The utility model relates to a selective electroplating fixture for a valve automatic line, which is mainly formed by a movable cathode assembly, an anode assembly and an adjusting lower valve positioning assembly, wherein the movable cathode assembly consists of a cathode cylinder, a cathode fixing plate and an elastic electroplating cathode; the anode assembly consists of a support, an anode fixing plate, an electroplating anode and an upper valve positioning piece; and the adjusting lower valve positioning assembly consists of a lower positioning cylinder, a lower positioning plate and a lower valve positioning piece. Since an electroplating profiling anode and an elastic cathode are adopted, thirty-six independent small power supplies are used to respectively supply power to thirty-six corresponding valves, and the upper valve positioning piece and the lower valve positioning piece are used for shielding the parts not to be plated of the valves, the consistency of the bottom application length and the pla</description><subject>APPARATUS THEREFOR</subject><subject>CHEMISTRY</subject><subject>ELECTROFORMING</subject><subject>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</subject><subject>METALLURGY</subject><subject>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2010</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLAMTs1JTS7JLEtVADOK8gtyEksy89IV0jIrSkqLUhXS8osUyhJzgAoSS0vyc4GSyQo5mXmpPAysaYk5xam8UJqbQcnNNcTZQze1ID8-tbggMTk1L7Uk3tnPyMDQzNjE3MIyNNSYKEUA73QwIA</recordid><startdate>20101117</startdate><enddate>20101117</enddate><creator>ZHENG XIAOYUAN</creator><creator>CHEN GANG</creator><creator>LUO JIANDONG</creator><creator>LIAO SHILEI</creator><creator>DENG JIANXIONG</creator><creator>LU JIECHU</creator><creator>LUO PENG</creator><creator>HUANG LIXUN</creator><creator>LI QU</creator><creator>NING ZHIJIAN</creator><scope>EVB</scope></search><sort><creationdate>20101117</creationdate><title>Selective electroplating fixture for valve automatic line</title><author>ZHENG XIAOYUAN ; CHEN GANG ; LUO JIANDONG ; LIAO SHILEI ; DENG JIANXIONG ; LU JIECHU ; LUO PENG ; HUANG LIXUN ; LI QU ; NING ZHIJIAN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN201634789UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2010</creationdate><topic>APPARATUS THEREFOR</topic><topic>CHEMISTRY</topic><topic>ELECTROFORMING</topic><topic>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</topic><topic>METALLURGY</topic><topic>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</topic><toplevel>online_resources</toplevel><creatorcontrib>ZHENG XIAOYUAN</creatorcontrib><creatorcontrib>CHEN GANG</creatorcontrib><creatorcontrib>LUO JIANDONG</creatorcontrib><creatorcontrib>LIAO SHILEI</creatorcontrib><creatorcontrib>DENG JIANXIONG</creatorcontrib><creatorcontrib>LU JIECHU</creatorcontrib><creatorcontrib>LUO PENG</creatorcontrib><creatorcontrib>HUANG LIXUN</creatorcontrib><creatorcontrib>LI QU</creatorcontrib><creatorcontrib>NING ZHIJIAN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ZHENG XIAOYUAN</au><au>CHEN GANG</au><au>LUO JIANDONG</au><au>LIAO SHILEI</au><au>DENG JIANXIONG</au><au>LU JIECHU</au><au>LUO PENG</au><au>HUANG LIXUN</au><au>LI QU</au><au>NING ZHIJIAN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Selective electroplating fixture for valve automatic line</title><date>2010-11-17</date><risdate>2010</risdate><abstract>The utility model relates to a selective electroplating fixture for a valve automatic line, which is mainly formed by a movable cathode assembly, an anode assembly and an adjusting lower valve positioning assembly, wherein the movable cathode assembly consists of a cathode cylinder, a cathode fixing plate and an elastic electroplating cathode; the anode assembly consists of a support, an anode fixing plate, an electroplating anode and an upper valve positioning piece; and the adjusting lower valve positioning assembly consists of a lower positioning cylinder, a lower positioning plate and a lower valve positioning piece. Since an electroplating profiling anode and an elastic cathode are adopted, thirty-six independent small power supplies are used to respectively supply power to thirty-six corresponding valves, and the upper valve positioning piece and the lower valve positioning piece are used for shielding the parts not to be plated of the valves, the consistency of the bottom application length and the pla</abstract><oa>free_for_read</oa></addata></record> |
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subjects | APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS |
title | Selective electroplating fixture for valve automatic line |
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