Device for adhering semiconductor chips

A device for adhering semiconductor chips comprises a package carrier transmission module, a wafer load module, a chip picking and placing module and a wafer lamination module, wherein the package carrier transmission module is provided with a plurality of groups of first track mechanisms arranged in parallel, each first track mechanism is provided with a package carrier positioning transmission device, the wafer picking and placing module is used for picking up chips of wafers on the wafer load module and moving the picked chips to a package carrier on a package carrier positioning transmission device, and at same time, applying a first pressure to the chips and the package carrier so that the chips are temporarily adhered on the package carrier, the water lamination module comprises a lamination carrier and a plurality of lamination heads, the lamination carrier is provided with a second track mechanism which can carry the package carriers output by the first track mechanisms, so that the chips can be stabl