Combination type internal memory radiating device

The utility model discloses a combined memory radiator, which is clamped and arranged at two sides of a memory provided with a central cushion chip, and comprises a front radiating fin which is contacted with the facade of the memory, a rear radiating fin which is contacted with the back facade of t...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: SHAO SHITING, WANG WEN, TAI XIAOLIANG
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator SHAO SHITING
WANG WEN
TAI XIAOLIANG
description The utility model discloses a combined memory radiator, which is clamped and arranged at two sides of a memory provided with a central cushion chip, and comprises a front radiating fin which is contacted with the facade of the memory, a rear radiating fin which is contacted with the back facade of the memory, and a radiating block which is nested in the front radiating fin and contacted with the central cushion chip; the two ends of the memory radiator are provided with a catching groove and a catching part which are oppositely arranged and can carry out fast positioning to install the two radiating fins on the memory; the memory radiator also includes a group of back splints which are buttoned from the upper part of the two radiating fins. The combined memory radiator largely enhances the heat dissipation and the protection effects of the memory, especially the central cushion chip region with highest temperature.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN201199521YY</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN201199521YY</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN201199521YY3</originalsourceid><addsrcrecordid>eNrjZDB0zs9NysxLLMnMz1MoqSxIVcjMK0ktykvMUchNzc0vqlQoSkzJBErnpSukpJZlJqfyMLCmJeYUp_JCaW4GJTfXEGcP3dSC_PjU4oLE5NS81JJ4Zz8jA0NDS0tTI8PISGOiFAEAHwgs5g</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Combination type internal memory radiating device</title><source>esp@cenet</source><creator>SHAO SHITING ; WANG WEN ; TAI XIAOLIANG</creator><creatorcontrib>SHAO SHITING ; WANG WEN ; TAI XIAOLIANG</creatorcontrib><description>The utility model discloses a combined memory radiator, which is clamped and arranged at two sides of a memory provided with a central cushion chip, and comprises a front radiating fin which is contacted with the facade of the memory, a rear radiating fin which is contacted with the back facade of the memory, and a radiating block which is nested in the front radiating fin and contacted with the central cushion chip; the two ends of the memory radiator are provided with a catching groove and a catching part which are oppositely arranged and can carry out fast positioning to install the two radiating fins on the memory; the memory radiator also includes a group of back splints which are buttoned from the upper part of the two radiating fins. The combined memory radiator largely enhances the heat dissipation and the protection effects of the memory, especially the central cushion chip region with highest temperature.</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INFORMATION STORAGE ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PHYSICS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES ; STATIC STORES</subject><creationdate>2009</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20090225&amp;DB=EPODOC&amp;CC=CN&amp;NR=201199521Y$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20090225&amp;DB=EPODOC&amp;CC=CN&amp;NR=201199521Y$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SHAO SHITING</creatorcontrib><creatorcontrib>WANG WEN</creatorcontrib><creatorcontrib>TAI XIAOLIANG</creatorcontrib><title>Combination type internal memory radiating device</title><description>The utility model discloses a combined memory radiator, which is clamped and arranged at two sides of a memory provided with a central cushion chip, and comprises a front radiating fin which is contacted with the facade of the memory, a rear radiating fin which is contacted with the back facade of the memory, and a radiating block which is nested in the front radiating fin and contacted with the central cushion chip; the two ends of the memory radiator are provided with a catching groove and a catching part which are oppositely arranged and can carry out fast positioning to install the two radiating fins on the memory; the memory radiator also includes a group of back splints which are buttoned from the upper part of the two radiating fins. The combined memory radiator largely enhances the heat dissipation and the protection effects of the memory, especially the central cushion chip region with highest temperature.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INFORMATION STORAGE</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PHYSICS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>STATIC STORES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2009</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDB0zs9NysxLLMnMz1MoqSxIVcjMK0ktykvMUchNzc0vqlQoSkzJBErnpSukpJZlJqfyMLCmJeYUp_JCaW4GJTfXEGcP3dSC_PjU4oLE5NS81JJ4Zz8jA0NDS0tTI8PISGOiFAEAHwgs5g</recordid><startdate>20090225</startdate><enddate>20090225</enddate><creator>SHAO SHITING</creator><creator>WANG WEN</creator><creator>TAI XIAOLIANG</creator><scope>EVB</scope></search><sort><creationdate>20090225</creationdate><title>Combination type internal memory radiating device</title><author>SHAO SHITING ; WANG WEN ; TAI XIAOLIANG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN201199521YY3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2009</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INFORMATION STORAGE</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PHYSICS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>STATIC STORES</topic><toplevel>online_resources</toplevel><creatorcontrib>SHAO SHITING</creatorcontrib><creatorcontrib>WANG WEN</creatorcontrib><creatorcontrib>TAI XIAOLIANG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SHAO SHITING</au><au>WANG WEN</au><au>TAI XIAOLIANG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Combination type internal memory radiating device</title><date>2009-02-25</date><risdate>2009</risdate><abstract>The utility model discloses a combined memory radiator, which is clamped and arranged at two sides of a memory provided with a central cushion chip, and comprises a front radiating fin which is contacted with the facade of the memory, a rear radiating fin which is contacted with the back facade of the memory, and a radiating block which is nested in the front radiating fin and contacted with the central cushion chip; the two ends of the memory radiator are provided with a catching groove and a catching part which are oppositely arranged and can carry out fast positioning to install the two radiating fins on the memory; the memory radiator also includes a group of back splints which are buttoned from the upper part of the two radiating fins. The combined memory radiator largely enhances the heat dissipation and the protection effects of the memory, especially the central cushion chip region with highest temperature.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language chi ; eng
recordid cdi_epo_espacenet_CN201199521YY
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INFORMATION STORAGE
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PHYSICS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
STATIC STORES
title Combination type internal memory radiating device
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-22T08%3A55%3A20IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=SHAO%20SHITING&rft.date=2009-02-25&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN201199521YY%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true