Method and management module for reducing heat effect

An array of electronic devices includes at least one throttlable device in the array of devices and a management module connected to the at least one throttlable device for reducing heat effects to an overheating device from neighboring devices in the array of electronic devices device. The manageme...

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1. Verfasser:	CAMPBELL KEITH M.,FRANKE JEFFERY M.,JOHNSON DONALD E.,JOHNSTON BROOKS
Format:	Patent
Sprache:	eng
Schlagworte:	CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PHYSICS PRINTED CIRCUITS
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creator	CAMPBELL KEITH M.,FRANKE JEFFERY M.,JOHNSON DONALD E.,JOHNSTON BROOKS
description	An array of electronic devices includes at least one throttlable device in the array of devices and a management module connected to the at least one throttlable device for reducing heat effects to an overheating device from neighboring devices in the array of electronic devices device. The management module is configured to detect the overheating of the overheating device, detect at least one throttlable device neighboring the overheating device and in the array of devices, and throttle the at least one throttlable device. The array of devices are an array of blade servers within a blade center, and the management module is separate from the at least one throttlable device.
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subjects	CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PHYSICS PRINTED CIRCUITS
title	Method and management module for reducing heat effect
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