Liquid epoxy resin composition

This invention provides an amine type curing agent epoxy resin composition has excellent conservation and solder connective property for no flowage processing semiconductor device with fixing CMOS chip conversely. A liquid epoxy resin composition comprising: (A) a liquid epoxy resin; (B) an amine ty...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	ASANO MASATOSHI,KATOH KAORU,SUMITA KAZUAKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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