Polishing pad and method for manufacture of semiconductor device using the same
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| creator | SHIMOMURA TETSUO,NAKAMORI MASAHIKO,YAMADA TAKATOSHI,KAZUNO ATSUSHI,OGAWA KAZUYUKI,NAKAI YOSHIYUKI |
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| language | eng |
| recordid | cdi_epo_espacenet_CN1950930A |
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| subjects | BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TOOLS FOR GRINDING, BUFFING, OR SHARPENING TRANSPORTING |
| title | Polishing pad and method for manufacture of semiconductor device using the same |
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