Impregnating resin formulation

The invention relates to an impregnating resin preparation containing a component A which contains an unsaturated polyester resin comprising allyethers, a component B which contains dicyclopentadiene terminated, unsaturated polyester resin which is different from the component A, a component C which...

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Hauptverfasser: LIENERT KLAUS-W, TOEDTER-KOENIG SASCHA, ABENDROTH MARK, HEGEMANN GUENTER
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Sprache:chi ; eng
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creator LIENERT KLAUS-W
TOEDTER-KOENIG SASCHA
ABENDROTH MARK
HEGEMANN GUENTER
description The invention relates to an impregnating resin preparation containing a component A which contains an unsaturated polyester resin comprising allyethers, a component B which contains dicyclopentadiene terminated, unsaturated polyester resin which is different from the component A, a component C which contains an additional unsaturated polymer which is different from polyester resins of components A and B, and, optionally, hardeners, accelerators, stabiliziers, additives and rheology additives. Said invention also relates to the use thereof in order to impregnate windings for the production of base materials of flat isolating material and in order to cover printed circuit boards.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN1942520BB</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN1942520BB</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN1942520BB3</originalsourceid><addsrcrecordid>eNrjZJDzzC0oSk3PSyzJzEtXKEotzsxTSMsvyi3NAYrk5_EwsKYl5hSn8kJpbgYFN9cQZw_d1IL8-NTigsTk1LzUknhnP0NLEyNTIwMnJ2MilAAA5QwkrQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Impregnating resin formulation</title><source>esp@cenet</source><creator>LIENERT KLAUS-W ; TOEDTER-KOENIG SASCHA ; ABENDROTH MARK ; HEGEMANN GUENTER</creator><creatorcontrib>LIENERT KLAUS-W ; TOEDTER-KOENIG SASCHA ; ABENDROTH MARK ; HEGEMANN GUENTER</creatorcontrib><description>The invention relates to an impregnating resin preparation containing a component A which contains an unsaturated polyester resin comprising allyethers, a component B which contains dicyclopentadiene terminated, unsaturated polyester resin which is different from the component A, a component C which contains an additional unsaturated polymer which is different from polyester resins of components A and B, and, optionally, hardeners, accelerators, stabiliziers, additives and rheology additives. Said invention also relates to the use thereof in order to impregnate windings for the production of base materials of flat isolating material and in order to cover printed circuit boards.</description><language>chi ; eng</language><subject>ADHESIVES ; BASIC ELECTRIC ELEMENTS ; CABLES ; CHEMICAL PAINT OR INK REMOVERS ; CHEMISTRY ; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; CONDUCTORS ; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER ; CORRECTING FLUIDS ; DYES ; DYNAMO-ELECTRIC MACHINES ; ELECTRICITY ; FILLING PASTES ; GENERATION ; INKS ; INSULATORS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; ORGANIC MACROMOLECULAR COMPOUNDS ; PAINTS ; PASTES OR SOLIDS FOR COLOURING OR PRINTING ; POLISHES ; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF MATERIALS THEREFOR ; WOODSTAINS</subject><creationdate>2011</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20110518&amp;DB=EPODOC&amp;CC=CN&amp;NR=1942520B$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25555,76308</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20110518&amp;DB=EPODOC&amp;CC=CN&amp;NR=1942520B$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LIENERT KLAUS-W</creatorcontrib><creatorcontrib>TOEDTER-KOENIG SASCHA</creatorcontrib><creatorcontrib>ABENDROTH MARK</creatorcontrib><creatorcontrib>HEGEMANN GUENTER</creatorcontrib><title>Impregnating resin formulation</title><description>The invention relates to an impregnating resin preparation containing a component A which contains an unsaturated polyester resin comprising allyethers, a component B which contains dicyclopentadiene terminated, unsaturated polyester resin which is different from the component A, a component C which contains an additional unsaturated polymer which is different from polyester resins of components A and B, and, optionally, hardeners, accelerators, stabiliziers, additives and rheology additives. Said invention also relates to the use thereof in order to impregnate windings for the production of base materials of flat isolating material and in order to cover printed circuit boards.</description><subject>ADHESIVES</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CABLES</subject><subject>CHEMICAL PAINT OR INK REMOVERS</subject><subject>CHEMISTRY</subject><subject>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>CONDUCTORS</subject><subject>CONVERSION OR DISTRIBUTION OF ELECTRIC POWER</subject><subject>CORRECTING FLUIDS</subject><subject>DYES</subject><subject>DYNAMO-ELECTRIC MACHINES</subject><subject>ELECTRICITY</subject><subject>FILLING PASTES</subject><subject>GENERATION</subject><subject>INKS</subject><subject>INSULATORS</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PAINTS</subject><subject>PASTES OR SOLIDS FOR COLOURING OR PRINTING</subject><subject>POLISHES</subject><subject>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF MATERIALS THEREFOR</subject><subject>WOODSTAINS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2011</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJDzzC0oSk3PSyzJzEtXKEotzsxTSMsvyi3NAYrk5_EwsKYl5hSn8kJpbgYFN9cQZw_d1IL8-NTigsTk1LzUknhnP0NLEyNTIwMnJ2MilAAA5QwkrQ</recordid><startdate>20110518</startdate><enddate>20110518</enddate><creator>LIENERT KLAUS-W</creator><creator>TOEDTER-KOENIG SASCHA</creator><creator>ABENDROTH MARK</creator><creator>HEGEMANN GUENTER</creator><scope>EVB</scope></search><sort><creationdate>20110518</creationdate><title>Impregnating resin formulation</title><author>LIENERT KLAUS-W ; TOEDTER-KOENIG SASCHA ; ABENDROTH MARK ; HEGEMANN GUENTER</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN1942520BB3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2011</creationdate><topic>ADHESIVES</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CABLES</topic><topic>CHEMICAL PAINT OR INK REMOVERS</topic><topic>CHEMISTRY</topic><topic>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>CONDUCTORS</topic><topic>CONVERSION OR DISTRIBUTION OF ELECTRIC POWER</topic><topic>CORRECTING FLUIDS</topic><topic>DYES</topic><topic>DYNAMO-ELECTRIC MACHINES</topic><topic>ELECTRICITY</topic><topic>FILLING PASTES</topic><topic>GENERATION</topic><topic>INKS</topic><topic>INSULATORS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PAINTS</topic><topic>PASTES OR SOLIDS FOR COLOURING OR PRINTING</topic><topic>POLISHES</topic><topic>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF MATERIALS THEREFOR</topic><topic>WOODSTAINS</topic><toplevel>online_resources</toplevel><creatorcontrib>LIENERT KLAUS-W</creatorcontrib><creatorcontrib>TOEDTER-KOENIG SASCHA</creatorcontrib><creatorcontrib>ABENDROTH MARK</creatorcontrib><creatorcontrib>HEGEMANN GUENTER</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LIENERT KLAUS-W</au><au>TOEDTER-KOENIG SASCHA</au><au>ABENDROTH MARK</au><au>HEGEMANN GUENTER</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Impregnating resin formulation</title><date>2011-05-18</date><risdate>2011</risdate><abstract>The invention relates to an impregnating resin preparation containing a component A which contains an unsaturated polyester resin comprising allyethers, a component B which contains dicyclopentadiene terminated, unsaturated polyester resin which is different from the component A, a component C which contains an additional unsaturated polymer which is different from polyester resins of components A and B, and, optionally, hardeners, accelerators, stabiliziers, additives and rheology additives. Said invention also relates to the use thereof in order to impregnate windings for the production of base materials of flat isolating material and in order to cover printed circuit boards.</abstract><oa>free_for_read</oa></addata></record>
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language chi ; eng
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subjects ADHESIVES
BASIC ELECTRIC ELEMENTS
CABLES
CHEMICAL PAINT OR INK REMOVERS
CHEMISTRY
COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
CONDUCTORS
CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
CORRECTING FLUIDS
DYES
DYNAMO-ELECTRIC MACHINES
ELECTRICITY
FILLING PASTES
GENERATION
INKS
INSULATORS
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
ORGANIC MACROMOLECULAR COMPOUNDS
PAINTS
PASTES OR SOLIDS FOR COLOURING OR PRINTING
POLISHES
SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF MATERIALS THEREFOR
WOODSTAINS
title Impregnating resin formulation
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