Component mounting apparatus including a demagnetizing device and method thereof
An electronic component mounting apparatus that includes a demagnetizer used to demagnetize a head nozzle, and a method for demagnetizing an electronic component apparatus. The method may include setting conditions, mounting electronic components, and demagnetizing a head nozzle of the electronic co...
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | SHIN DONG-WOO,BAE BYONG-KUN,OH NAM-YONG,LEE DONGUN,HAN SEONGAN,HWANG SUN-KYU |
| description | An electronic component mounting apparatus that includes a demagnetizer used to demagnetize a head nozzle, and a method for demagnetizing an electronic component apparatus. The method may include setting conditions, mounting electronic components, and demagnetizing a head nozzle of the electronic component mounting apparatus based on the conditions. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN1882241A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN1882241A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN1882241A3</originalsourceid><addsrcrecordid>eNrjZAhwzs8tyM9LzStRyM0vzSvJzEtXSCwoSCxKLCktVsjMS84pTQGLKaSk5iam56WWZFaB-CmpZZnJqQqJeSkKuaklGfkpCiUZqUWp-Wk8DKxpiTnFqbxQmptB3s01xNlDN7UgPz61uCAxORVoSLyzn6GFhZGRiaGjMWEVABbfNxE</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Component mounting apparatus including a demagnetizing device and method thereof</title><source>esp@cenet</source><creator>SHIN DONG-WOO,BAE BYONG-KUN,OH NAM-YONG,LEE DONGUN,HAN SEONGAN,HWANG SUN-KYU</creator><creatorcontrib>SHIN DONG-WOO,BAE BYONG-KUN,OH NAM-YONG,LEE DONGUN,HAN SEONGAN,HWANG SUN-KYU</creatorcontrib><description>An electronic component mounting apparatus that includes a demagnetizer used to demagnetize a head nozzle, and a method for demagnetizing an electronic component apparatus. The method may include setting conditions, mounting electronic components, and demagnetizing a head nozzle of the electronic component mounting apparatus based on the conditions.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC ; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES ; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ; TECHNICAL SUBJECTS COVERED BY FORMER USPC ; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS</subject><creationdate>2006</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20061220&DB=EPODOC&CC=CN&NR=1882241A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20061220&DB=EPODOC&CC=CN&NR=1882241A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SHIN DONG-WOO,BAE BYONG-KUN,OH NAM-YONG,LEE DONGUN,HAN SEONGAN,HWANG SUN-KYU</creatorcontrib><title>Component mounting apparatus including a demagnetizing device and method thereof</title><description>An electronic component mounting apparatus that includes a demagnetizer used to demagnetize a head nozzle, and a method for demagnetizing an electronic component apparatus. The method may include setting conditions, mounting electronic components, and demagnetizing a head nozzle of the electronic component mounting apparatus based on the conditions.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC</subject><subject>GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER USPC</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2006</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZAhwzs8tyM9LzStRyM0vzSvJzEtXSCwoSCxKLCktVsjMS84pTQGLKaSk5iam56WWZFaB-CmpZZnJqQqJeSkKuaklGfkpCiUZqUWp-Wk8DKxpiTnFqbxQmptB3s01xNlDN7UgPz61uCAxORVoSLyzn6GFhZGRiaGjMWEVABbfNxE</recordid><startdate>20061220</startdate><enddate>20061220</enddate><creator>SHIN DONG-WOO,BAE BYONG-KUN,OH NAM-YONG,LEE DONGUN,HAN SEONGAN,HWANG SUN-KYU</creator><scope>EVB</scope></search><sort><creationdate>20061220</creationdate><title>Component mounting apparatus including a demagnetizing device and method thereof</title><author>SHIN DONG-WOO,BAE BYONG-KUN,OH NAM-YONG,LEE DONGUN,HAN SEONGAN,HWANG SUN-KYU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN1882241A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2006</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC</topic><topic>GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER USPC</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS</topic><toplevel>online_resources</toplevel><creatorcontrib>SHIN DONG-WOO,BAE BYONG-KUN,OH NAM-YONG,LEE DONGUN,HAN SEONGAN,HWANG SUN-KYU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SHIN DONG-WOO,BAE BYONG-KUN,OH NAM-YONG,LEE DONGUN,HAN SEONGAN,HWANG SUN-KYU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Component mounting apparatus including a demagnetizing device and method thereof</title><date>2006-12-20</date><risdate>2006</risdate><abstract>An electronic component mounting apparatus that includes a demagnetizer used to demagnetize a head nozzle, and a method for demagnetizing an electronic component apparatus. The method may include setting conditions, mounting electronic components, and demagnetizing a head nozzle of the electronic component mounting apparatus based on the conditions.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_CN1882241A |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS |
| title | Component mounting apparatus including a demagnetizing device and method thereof |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-26T15%3A02%3A22IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=SHIN%20DONG-WOO,BAE%20BYONG-KUN,OH%20NAM-YONG,LEE%20DONGUN,HAN%20SEONGAN,HWANG%20SUN-KYU&rft.date=2006-12-20&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN1882241A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |