Electroplating apparatus

Electroplating apparatus

An electroplating apparatus is provided which includes a solution tank which has at least a bottom plate and a side plate and inside which electroplating solution is poured and a cathode plate and an anode plate which are horizontally placed so as to face each other in the electroplating solution in...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: YAMAMOTO WATARU,AKIYAMA KATSUNORI,KATSUMOTO TOKIKO
Format: Patent
Sprache:eng
Schlagworte:
APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Beschreibung
Zusammenfassung:An electroplating apparatus is provided which includes a solution tank which has at least a bottom plate and a side plate and inside which electroplating solution is poured and a cathode plate and an anode plate which are horizontally placed so as to face each other in the electroplating solution in the solution tank, in which one plate of the cathode plate and the anode plate is an object to be electroplated and placed in a lower position than the other plate, in which an opening through which the cathode plate and the anode plate are inserted into the solution tank is provided in the side plate of the solution tank, and in which a shield plate which is detachable shields the opening of the solution tank.