Resin molding apparatus

A resin molding apparatus (100) includes a fixing member (4) to which a top mold (2) is attached, a movable member (5) to which a bottom mold (3) is attached, a push-up member (8) provided below the movable member (5), a drive mechanism (7) moving the push-up member (8) in upward/downward direction,...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	BANJO TOSHINOBU,HIRATA SHIGERU,SHIRASAWA MASANORI
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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