Gooey composition of flexible printing wiring plate and adhibit thin film using thereof

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: KUWABARA NORIKO,OBA HISAE,YUASA TOMOHITO,KONO MARI
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator KUWABARA NORIKO,OBA HISAE,YUASA TOMOHITO,KONO MARI
description
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN1831074A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN1831074A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN1831074A3</originalsourceid><addsrcrecordid>eNqFyrEKwjAQANAsDqJ-g_cDBUsFXaVYnZwEx5K2l-YgvQvJifr3UnB3estbmsdFBD_QyxQlk5IwiAMX8E1dQIiJWIlHeFGaicEqguUB7OCpIwX1xOAoTPDM81CPCcWtzcLZkHHzc2W2zfleXwuM0mKOtkdGbetbeazK3WF_qv6PL58uOUg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Gooey composition of flexible printing wiring plate and adhibit thin film using thereof</title><source>esp@cenet</source><creator>KUWABARA NORIKO,OBA HISAE,YUASA TOMOHITO,KONO MARI</creator><creatorcontrib>KUWABARA NORIKO,OBA HISAE,YUASA TOMOHITO,KONO MARI</creatorcontrib><language>eng</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; DYES ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; PAINTS ; POLISHES ; PRINTED CIRCUITS ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2006</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20060913&amp;DB=EPODOC&amp;CC=CN&amp;NR=1831074A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20060913&amp;DB=EPODOC&amp;CC=CN&amp;NR=1831074A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KUWABARA NORIKO,OBA HISAE,YUASA TOMOHITO,KONO MARI</creatorcontrib><title>Gooey composition of flexible printing wiring plate and adhibit thin film using thereof</title><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMISTRY</subject><subject>DYES</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>PRINTED CIRCUITS</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2006</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqFyrEKwjAQANAsDqJ-g_cDBUsFXaVYnZwEx5K2l-YgvQvJifr3UnB3estbmsdFBD_QyxQlk5IwiAMX8E1dQIiJWIlHeFGaicEqguUB7OCpIwX1xOAoTPDM81CPCcWtzcLZkHHzc2W2zfleXwuM0mKOtkdGbetbeazK3WF_qv6PL58uOUg</recordid><startdate>20060913</startdate><enddate>20060913</enddate><creator>KUWABARA NORIKO,OBA HISAE,YUASA TOMOHITO,KONO MARI</creator><scope>EVB</scope></search><sort><creationdate>20060913</creationdate><title>Gooey composition of flexible printing wiring plate and adhibit thin film using thereof</title><author>KUWABARA NORIKO,OBA HISAE,YUASA TOMOHITO,KONO MARI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN1831074A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2006</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMISTRY</topic><topic>DYES</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>PRINTED CIRCUITS</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><toplevel>online_resources</toplevel><creatorcontrib>KUWABARA NORIKO,OBA HISAE,YUASA TOMOHITO,KONO MARI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KUWABARA NORIKO,OBA HISAE,YUASA TOMOHITO,KONO MARI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Gooey composition of flexible printing wiring plate and adhibit thin film using thereof</title><date>2006-09-13</date><risdate>2006</risdate><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_CN1831074A
source esp@cenet
subjects ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMISTRY
DYES
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
PRINTED CIRCUITS
USE OF MATERIALS AS ADHESIVES
title Gooey composition of flexible printing wiring plate and adhibit thin film using thereof
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-03T10%3A21%3A18IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=KUWABARA%20NORIKO,OBA%20HISAE,YUASA%20TOMOHITO,KONO%20MARI&rft.date=2006-09-13&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN1831074A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true