Gooey composition of flexible printing wiring plate and adhibit thin film using thereof
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creator | KUWABARA NORIKO,OBA HISAE,YUASA TOMOHITO,KONO MARI |
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fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN1831074A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN1831074A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN1831074A3</originalsourceid><addsrcrecordid>eNqFyrEKwjAQANAsDqJ-g_cDBUsFXaVYnZwEx5K2l-YgvQvJifr3UnB3estbmsdFBD_QyxQlk5IwiAMX8E1dQIiJWIlHeFGaicEqguUB7OCpIwX1xOAoTPDM81CPCcWtzcLZkHHzc2W2zfleXwuM0mKOtkdGbetbeazK3WF_qv6PL58uOUg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Gooey composition of flexible printing wiring plate and adhibit thin film using thereof</title><source>esp@cenet</source><creator>KUWABARA NORIKO,OBA HISAE,YUASA TOMOHITO,KONO MARI</creator><creatorcontrib>KUWABARA NORIKO,OBA HISAE,YUASA TOMOHITO,KONO MARI</creatorcontrib><language>eng</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; DYES ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; PAINTS ; POLISHES ; PRINTED CIRCUITS ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2006</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20060913&DB=EPODOC&CC=CN&NR=1831074A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20060913&DB=EPODOC&CC=CN&NR=1831074A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KUWABARA NORIKO,OBA HISAE,YUASA TOMOHITO,KONO MARI</creatorcontrib><title>Gooey composition of flexible printing wiring plate and adhibit thin film using thereof</title><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMISTRY</subject><subject>DYES</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>PRINTED CIRCUITS</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2006</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqFyrEKwjAQANAsDqJ-g_cDBUsFXaVYnZwEx5K2l-YgvQvJifr3UnB3estbmsdFBD_QyxQlk5IwiAMX8E1dQIiJWIlHeFGaicEqguUB7OCpIwX1xOAoTPDM81CPCcWtzcLZkHHzc2W2zfleXwuM0mKOtkdGbetbeazK3WF_qv6PL58uOUg</recordid><startdate>20060913</startdate><enddate>20060913</enddate><creator>KUWABARA NORIKO,OBA HISAE,YUASA TOMOHITO,KONO MARI</creator><scope>EVB</scope></search><sort><creationdate>20060913</creationdate><title>Gooey composition of flexible printing wiring plate and adhibit thin film using thereof</title><author>KUWABARA NORIKO,OBA HISAE,YUASA TOMOHITO,KONO MARI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN1831074A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2006</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMISTRY</topic><topic>DYES</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>PRINTED CIRCUITS</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><toplevel>online_resources</toplevel><creatorcontrib>KUWABARA NORIKO,OBA HISAE,YUASA TOMOHITO,KONO MARI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KUWABARA NORIKO,OBA HISAE,YUASA TOMOHITO,KONO MARI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Gooey composition of flexible printing wiring plate and adhibit thin film using thereof</title><date>2006-09-13</date><risdate>2006</risdate><oa>free_for_read</oa></addata></record> |
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subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES PRINTED CIRCUITS USE OF MATERIALS AS ADHESIVES |
title | Gooey composition of flexible printing wiring plate and adhibit thin film using thereof |
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