Sensor packing structure, sensor packing process, sensor module and mfg. method thereof

Sensor packing structure, sensor packing process, sensor module and mfg. method thereof

The invention relates to a sensor packaging structure, a sensor packaging structure manufacturing process, and a sensor module and the manufacturing method thereof. And the sensor packaging structure comprises: a sensing chip, a cover plate, a bottom sealing frame, a top sealing frame and a welding...

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1. Verfasser: QIHONG,XIE YE
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PICTORIAL COMMUNICATION, e.g. TELEVISION
SEMICONDUCTOR DEVICES
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creator QIHONG,XIE YE
description The invention relates to a sensor packaging structure, a sensor packaging structure manufacturing process, and a sensor module and the manufacturing method thereof. And the sensor packaging structure comprises: a sensing chip, a cover plate, a bottom sealing frame, a top sealing frame and a welding layer, where the sensing chip has a sensing region and plural welding pads outside the sensing region, the cover plate is arranged above the sensing chip, the bottom sealing frame encircles the sensing region and arranged on the sensing chip, the top sealing frame is arranged on the cover plate and above the bottom sealing frame, and the welding layer is connected between the top and bottom sealing frames to make the cover plate, sensing chip, bottom sealing frame and top sealing frame form a closed space. Besides, the invention also announces the manufacturing process of the sensor packaging structure, the sensor module and the method for manufacturing the sensor module.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PICTORIAL COMMUNICATION, e.g. TELEVISION
SEMICONDUCTOR DEVICES
title Sensor packing structure, sensor packing process, sensor module and mfg. method thereof
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