Electronic device, assembly and methods of manufacturing an electronic device

The invention relates to a microelectronic chip assembly ASS comprising at least three microelectronic chip ICH, TCH, BCH stacked together and on which integrated devices are formed. At least one of the chip, called intermediate chip ICH, includes via holes VH running through said chip ICH and fille...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	ROOZEBOOM FREDDY,BUIJSMAN ADRIANUS ALPHONSUS J.,GAMAND PATRICE,KEMMEREN ANTONIUS L. A.,HUBERT GERARDUS T. M
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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