Methods of manufacturing a capacitor and a semiconductor device

In methods of manufacturing a capacitor and a semiconductor device, a mold layer is formed on a substrate having a contact plug. The mold layer includes an opening exposing the contact plug. A conductive layer is formed on the contact plug, an inner sidewall of the opening and the mold layer. A phot...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	SHIM WOO-SEOK,PARK YOUNG-WOOK,LEE JUNG-HYEON,YOONKWANG-SUB,KIM CHUL-HO,PARK TAE-JIN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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