Etchant and etching method

Fluorescent probes represented by the general formula (I) wherein R and R are each hydrogen or a substituent for capturing a proton, a metal ion, or an active oxygen species; R is a monovalent substituent except hydrogen, carboxyl, and sulfo; R and R are each hydrogen, halogeno, or alkyl; R to R are...

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1. Verfasser: SAITO NORIYUKI,YOSHIDA TAKUJI,INOUE KAZUNORI,ISHIKAWA MAKOTO,KAMIHARAGUCHI YOSHIO
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creator SAITO NORIYUKI,YOSHIDA TAKUJI,INOUE KAZUNORI,ISHIKAWA MAKOTO,KAMIHARAGUCHI YOSHIO
description Fluorescent probes represented by the general formula (I) wherein R and R are each hydrogen or a substituent for capturing a proton, a metal ion, or an active oxygen species; R is a monovalent substituent except hydrogen, carboxyl, and sulfo; R and R are each hydrogen, halogeno, or alkyl; R to R are each alkyl; R and R are each hydrogen, halogeno, or alkyl; M is a counter ion; and before the capture of a proton, a metal ion, or an active oxygen species, the combination of R , R , and R gives the benzene ring to which they are bonded such a substantially high electron density as to make the compound substantially nonfluorescent, while after the capture of a proton, a metal ion, or an active oxygen species, the combination brings about such a substantial lowering in the electron density of the benzene ring to which they are bonded as to make the compound substantially highly fluorescent.
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subjects BASIC ELECTRIC ELEMENTS
CHEMICAL SURFACE TREATMENT
CHEMISTRY
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING MATERIAL WITH METALLIC MATERIAL
COATING METALLIC MATERIAL
DIFFUSION TREATMENT OF METALLIC MATERIAL
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL
METALLURGY
MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE
SEMICONDUCTOR DEVICES
title Etchant and etching method
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