Electronic part taping packaging cover tape

The present invention relates to a cover tape for tape packaging electronic components that heat-seals a carrier tape accommodating therein electronic components. A cover tape for tape packaging electronic components according to the present invention includes a substrate film layer, a soft material...

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Bibliographische Detailangaben
1. Verfasser:	FUJII KAZUHITO,KATOU SHINNICHI
Format:	Patent
Sprache:	eng
Schlagworte:	ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS CONVEYING DYES HANDLING THIN OR FILAMENTARY MATERIAL LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PACKAGES PACKAGING ELEMENTS PACKING PAINTS PERFORMING OPERATIONS POLISHES STORING TRANSPORTING USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The present invention relates to a cover tape for tape packaging electronic components that heat-seals a carrier tape accommodating therein electronic components. A cover tape for tape packaging electronic components according to the present invention includes a substrate film layer, a soft material layer, and a thermal adhesive layer. The soft material layer is formed of metallocene linear low-density polyethylene having a specific gravity in a range of from 0.888 to 0.907.