Laser beam machining method

A laser beam machining method capable of accurately cutting a workpiece along predicted cut lines, comprising the steps of forming cut start areas in the workpiece along the predicted cut lines by reformed areas formed by multiple photon absorption, and radiating laser beam having a permeability for...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	FUKUYO FUMITSUGU,FUKUMITSU KENSHI,UCHIYAMA NAOKI,WAKUDA TOSHIMITSU,ATSUMI KAZUHIRO,MURAMA KENICHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM WORKING CEMENT, CLAY, OR STONE WORKING STONE OR STONE-LIKE MATERIALS
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Beschreibung
Zusammenfassung:	A laser beam machining method capable of accurately cutting a workpiece along predicted cut lines, comprising the steps of forming cut start areas in the workpiece along the predicted cut lines by reformed areas formed by multiple photon absorption, and radiating laser beam having a permeability for the non-reformed areas of the workpiece onto the workpiece along the predicted cut lines to produce cracks in the workpiece starting at the cut start areas, whereby the workpiece can be accurately cut along the predicted cut lines and, since chips are separated from each other by extending an extension film for fixing the workpiece thereto, the certainty of cutting of the workpiece along the predicted cut lines can be further increased.