Apparatus and methods for constructing antennas using vias as radiating elements formed in a substrate

Antennas are provided which are constructed using one or more conductive via stubs as radiating elements formed in a substrate. The antennas can be integrally packaged with IC chips (e.g., IC transceivers, receivers, transmitters, etc.) to build integrated wireless or RF (radio frequency) communicat...

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Bibliographische Detailangaben
1. Verfasser: GAUCHER BRIAN P.,LIU DUIXIAN,RUDOLF PFEIFFER ULLRICH R.,ZWICK THOMAS M
Format: Patent
Sprache:eng
Schlagworte:
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