Optical/electrical interconnects and package for high speed signaling
An opto-electrical printed circuit board (PCB) and compatible opto-electrical package. The PCB includes a base material, one or more optical fibers imbedded in or on top of the base material, and one or more transparent substrates imbedded in or on top of the base material covering the optical fiber...
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| creator | LI YUANG-LIANG |
| description | An opto-electrical printed circuit board (PCB) and compatible opto-electrical package. The PCB includes a base material, one or more optical fibers imbedded in or on top of the base material, and one or more transparent substrates imbedded in or on top of the base material covering the optical fibers. The optical fibers provide a high speed interconnect between two or more electronic devices attached to the PCB. The electronic devices interface to the optical fibers through the transparent substrate. The opto-electrical package includes a base material, an optical receiver and an optical transmitter attached to the bottom side of the base material, an encapsulating polymer that covers the optical receiver and optical transmitter, and one or more power and ground connection points attached to the bottom side of the base material. |
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The PCB includes a base material, one or more optical fibers imbedded in or on top of the base material, and one or more transparent substrates imbedded in or on top of the base material covering the optical fibers. The optical fibers provide a high speed interconnect between two or more electronic devices attached to the PCB. The electronic devices interface to the optical fibers through the transparent substrate. The opto-electrical package includes a base material, an optical receiver and an optical transmitter attached to the bottom side of the base material, an encapsulating polymer that covers the optical receiver and optical transmitter, and one or more power and ground connection points attached to the bottom side of the base material.</description><edition>7</edition><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS ; OPTICS ; PHYSICS ; PRINTED CIRCUITS</subject><creationdate>2005</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20050427&DB=EPODOC&CC=CN&NR=1610852A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25569,76552</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20050427&DB=EPODOC&CC=CN&NR=1610852A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LI YUANG-LIANG</creatorcontrib><title>Optical/electrical interconnects and package for high speed signaling</title><description>An opto-electrical printed circuit board (PCB) and compatible opto-electrical package. The PCB includes a base material, one or more optical fibers imbedded in or on top of the base material, and one or more transparent substrates imbedded in or on top of the base material covering the optical fibers. The optical fibers provide a high speed interconnect between two or more electronic devices attached to the PCB. The electronic devices interface to the optical fibers through the transparent substrate. The opto-electrical package includes a base material, an optical receiver and an optical transmitter attached to the bottom side of the base material, an encapsulating polymer that covers the optical receiver and optical transmitter, and one or more power and ground connection points attached to the bottom side of the base material.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS</subject><subject>OPTICS</subject><subject>PHYSICS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2005</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHD1LyjJTE7M0U_NSU0uKQIxFTLzSlKLkvPz8oAixQqJeSkKBYnJ2YnpqQpp-UUKGZnpGQrFBampKQrFmel5iTmZeek8DKxpiTnFqbxQmptB3s01xNlDN7UgPz61GKg9NS-1JN7Zz9DM0MDC1MjRmLAKAEPvMns</recordid><startdate>20050427</startdate><enddate>20050427</enddate><creator>LI YUANG-LIANG</creator><scope>EVB</scope></search><sort><creationdate>20050427</creationdate><title>Optical/electrical interconnects and package for high speed signaling</title><author>LI YUANG-LIANG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN1610852A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2005</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS</topic><topic>OPTICS</topic><topic>PHYSICS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>LI YUANG-LIANG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LI YUANG-LIANG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Optical/electrical interconnects and package for high speed signaling</title><date>2005-04-27</date><risdate>2005</risdate><abstract>An opto-electrical printed circuit board (PCB) and compatible opto-electrical package. The PCB includes a base material, one or more optical fibers imbedded in or on top of the base material, and one or more transparent substrates imbedded in or on top of the base material covering the optical fibers. The optical fibers provide a high speed interconnect between two or more electronic devices attached to the PCB. The electronic devices interface to the optical fibers through the transparent substrate. The opto-electrical package includes a base material, an optical receiver and an optical transmitter attached to the bottom side of the base material, an encapsulating polymer that covers the optical receiver and optical transmitter, and one or more power and ground connection points attached to the bottom side of the base material.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| language | eng |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PHYSICS PRINTED CIRCUITS |
| title | Optical/electrical interconnects and package for high speed signaling |
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