Functional module with built-in flat plate type radiating element

The present invention provides a functional module with built-in plate radiating element. It includes a first circuit board, a second circuit board and a plate radiating element, in which said first circuit board has a first surface and on the first surface a first grounding layer is set, the second...

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Hauptverfasser: CANNAN JIAN, WENYAN LIN
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WENYAN LIN
description The present invention provides a functional module with built-in plate radiating element. It includes a first circuit board, a second circuit board and a plate radiating element, in which said first circuit board has a first surface and on the first surface a first grounding layer is set, the second circuit board is coupled with first circuit board, and has a second surface, and said second surface is opposite to the first surface, and on the second surface a second grounding layer is set, said plate radiating element is placed between the first circuit board and second circuit board in the mode of respectively connected with first grounding layer and second grounding layer. 本发明提供一种内建有平板式散热元件的功能模块,其包括一第一电路板、一第二电路板、以及一平板式散热元件,其中第一电路板具有一第一表面,且第一表面上设有一第一接地层,第二电路板与第一电路板耦合,且具有一第二表面,而第二表面与第一表面相对,且在其上设有一第二接地层,平板式散热元件以分别与第一接地层、第二接地层抵接的方式设置于第一电路板和第二电路板之间。
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN1549338A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN1549338A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN1549338A3</originalsourceid><addsrcrecordid>eNrjZHB0K81LLsnMz0vMUcjNTynNSVUozyzJUEgqzcwp0c3MU0jLSSxRKAASqQollQWpCkWJKZmJJZl56QqpOam5qXklPAysaYk5xam8UJqbQd7NNcTZQze1ID8-tbggMTk1L7Uk3tnP0NTE0tjYwtGYsAoAT9Qw-w</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Functional module with built-in flat plate type radiating element</title><source>esp@cenet</source><creator>CANNAN JIAN ; WENYAN LIN</creator><creatorcontrib>CANNAN JIAN ; WENYAN LIN</creatorcontrib><description>The present invention provides a functional module with built-in plate radiating element. It includes a first circuit board, a second circuit board and a plate radiating element, in which said first circuit board has a first surface and on the first surface a first grounding layer is set, the second circuit board is coupled with first circuit board, and has a second surface, and said second surface is opposite to the first surface, and on the second surface a second grounding layer is set, said plate radiating element is placed between the first circuit board and second circuit board in the mode of respectively connected with first grounding layer and second grounding layer. 本发明提供一种内建有平板式散热元件的功能模块,其包括一第一电路板、一第二电路板、以及一平板式散热元件,其中第一电路板具有一第一表面,且第一表面上设有一第一接地层,第二电路板与第一电路板耦合,且具有一第二表面,而第二表面与第一表面相对,且在其上设有一第二接地层,平板式散热元件以分别与第一接地层、第二接地层抵接的方式设置于第一电路板和第二电路板之间。</description><edition>7</edition><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; CALCULATING ; COMPUTING ; COUNTING ; ELECTRIC DIGITAL DATA PROCESSING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; PHYSICS ; SEMICONDUCTOR DEVICES</subject><creationdate>2004</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20041124&amp;DB=EPODOC&amp;CC=CN&amp;NR=1549338A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20041124&amp;DB=EPODOC&amp;CC=CN&amp;NR=1549338A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CANNAN JIAN</creatorcontrib><creatorcontrib>WENYAN LIN</creatorcontrib><title>Functional module with built-in flat plate type radiating element</title><description>The present invention provides a functional module with built-in plate radiating element. It includes a first circuit board, a second circuit board and a plate radiating element, in which said first circuit board has a first surface and on the first surface a first grounding layer is set, the second circuit board is coupled with first circuit board, and has a second surface, and said second surface is opposite to the first surface, and on the second surface a second grounding layer is set, said plate radiating element is placed between the first circuit board and second circuit board in the mode of respectively connected with first grounding layer and second grounding layer. 本发明提供一种内建有平板式散热元件的功能模块,其包括一第一电路板、一第二电路板、以及一平板式散热元件,其中第一电路板具有一第一表面,且第一表面上设有一第一接地层,第二电路板与第一电路板耦合,且具有一第二表面,而第二表面与第一表面相对,且在其上设有一第二接地层,平板式散热元件以分别与第一接地层、第二接地层抵接的方式设置于第一电路板和第二电路板之间。</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CALCULATING</subject><subject>COMPUTING</subject><subject>COUNTING</subject><subject>ELECTRIC DIGITAL DATA PROCESSING</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>PHYSICS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2004</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHB0K81LLsnMz0vMUcjNTynNSVUozyzJUEgqzcwp0c3MU0jLSSxRKAASqQollQWpCkWJKZmJJZl56QqpOam5qXklPAysaYk5xam8UJqbQd7NNcTZQze1ID8-tbggMTk1L7Uk3tnP0NTE0tjYwtGYsAoAT9Qw-w</recordid><startdate>20041124</startdate><enddate>20041124</enddate><creator>CANNAN JIAN</creator><creator>WENYAN LIN</creator><scope>EVB</scope></search><sort><creationdate>20041124</creationdate><title>Functional module with built-in flat plate type radiating element</title><author>CANNAN JIAN ; WENYAN LIN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN1549338A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2004</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CALCULATING</topic><topic>COMPUTING</topic><topic>COUNTING</topic><topic>ELECTRIC DIGITAL DATA PROCESSING</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>PHYSICS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>CANNAN JIAN</creatorcontrib><creatorcontrib>WENYAN LIN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CANNAN JIAN</au><au>WENYAN LIN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Functional module with built-in flat plate type radiating element</title><date>2004-11-24</date><risdate>2004</risdate><abstract>The present invention provides a functional module with built-in plate radiating element. It includes a first circuit board, a second circuit board and a plate radiating element, in which said first circuit board has a first surface and on the first surface a first grounding layer is set, the second circuit board is coupled with first circuit board, and has a second surface, and said second surface is opposite to the first surface, and on the second surface a second grounding layer is set, said plate radiating element is placed between the first circuit board and second circuit board in the mode of respectively connected with first grounding layer and second grounding layer. 本发明提供一种内建有平板式散热元件的功能模块,其包括一第一电路板、一第二电路板、以及一平板式散热元件,其中第一电路板具有一第一表面,且第一表面上设有一第一接地层,第二电路板与第一电路板耦合,且具有一第二表面,而第二表面与第一表面相对,且在其上设有一第二接地层,平板式散热元件以分别与第一接地层、第二接地层抵接的方式设置于第一电路板和第二电路板之间。</abstract><edition>7</edition><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
CALCULATING
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PHYSICS
SEMICONDUCTOR DEVICES
title Functional module with built-in flat plate type radiating element
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