EMI shielding for electronic packages
包含有EMI屏蔽的电子封装件，尤其是包含其中掩埋有接地带的半导体芯片载体结构的半导体器件，其适于降低用于高速开关电子封装的出射和入射EMI辐射。 Electronic packages incorporating EMI shielding, and particularly semiconductor devices which incorporate semiconductor chip-carrier structures having grounded bands embedded therein which are adapted to reduce outgoing and inc...
Gespeichert in:
| Hauptverfasser: | , , |
|---|---|
| Format: | Patent |
| Sprache: | chi ; eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | MICHAEL A. GAYNES JEFFREY T. COFFIN DAVID J. ALCOE |
| description | 包含有EMI屏蔽的电子封装件，尤其是包含其中掩埋有接地带的半导体芯片载体结构的半导体器件，其适于降低用于高速开关电子封装的出射和入射EMI辐射。
Electronic packages incorporating EMI shielding, and particularly semiconductor devices which incorporate semiconductor chip-carrier structures having grounded bands embedded therein which are adapted to reduce outgoing and incident EMI emissions for high-speed switching electronic packages. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN1539167A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN1539167A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN1539167A3</originalsourceid><addsrcrecordid>eNrjZFB19fVUKM7ITM1JycxLV0jLL1JIzUlNLinKz8tMVihITM5OTE8t5mFgTUvMKU7lhdLcDPJuriHOHrqpBfnxqcVAZal5qSXxzn6GpsaWhmbmjsaEVQAAfbUmCA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>EMI shielding for electronic packages</title><source>esp@cenet</source><creator>MICHAEL A. GAYNES ; JEFFREY T. COFFIN ; DAVID J. ALCOE</creator><creatorcontrib>MICHAEL A. GAYNES ; JEFFREY T. COFFIN ; DAVID J. ALCOE</creatorcontrib><description>包含有EMI屏蔽的电子封装件，尤其是包含其中掩埋有接地带的半导体芯片载体结构的半导体器件，其适于降低用于高速开关电子封装的出射和入射EMI辐射。
Electronic packages incorporating EMI shielding, and particularly semiconductor devices which incorporate semiconductor chip-carrier structures having grounded bands embedded therein which are adapted to reduce outgoing and incident EMI emissions for high-speed switching electronic packages.</description><edition>7</edition><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>2004</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20041020&DB=EPODOC&CC=CN&NR=1539167A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76418</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20041020&DB=EPODOC&CC=CN&NR=1539167A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MICHAEL A. GAYNES</creatorcontrib><creatorcontrib>JEFFREY T. COFFIN</creatorcontrib><creatorcontrib>DAVID J. ALCOE</creatorcontrib><title>EMI shielding for electronic packages</title><description>包含有EMI屏蔽的电子封装件，尤其是包含其中掩埋有接地带的半导体芯片载体结构的半导体器件，其适于降低用于高速开关电子封装的出射和入射EMI辐射。
Electronic packages incorporating EMI shielding, and particularly semiconductor devices which incorporate semiconductor chip-carrier structures having grounded bands embedded therein which are adapted to reduce outgoing and incident EMI emissions for high-speed switching electronic packages.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2004</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFB19fVUKM7ITM1JycxLV0jLL1JIzUlNLinKz8tMVihITM5OTE8t5mFgTUvMKU7lhdLcDPJuriHOHrqpBfnxqcVAZal5qSXxzn6GpsaWhmbmjsaEVQAAfbUmCA</recordid><startdate>20041020</startdate><enddate>20041020</enddate><creator>MICHAEL A. GAYNES</creator><creator>JEFFREY T. COFFIN</creator><creator>DAVID J. ALCOE</creator><scope>EVB</scope></search><sort><creationdate>20041020</creationdate><title>EMI shielding for electronic packages</title><author>MICHAEL A. GAYNES ; JEFFREY T. COFFIN ; DAVID J. ALCOE</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN1539167A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2004</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>MICHAEL A. GAYNES</creatorcontrib><creatorcontrib>JEFFREY T. COFFIN</creatorcontrib><creatorcontrib>DAVID J. ALCOE</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MICHAEL A. GAYNES</au><au>JEFFREY T. COFFIN</au><au>DAVID J. ALCOE</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>EMI shielding for electronic packages</title><date>2004-10-20</date><risdate>2004</risdate><abstract>包含有EMI屏蔽的电子封装件，尤其是包含其中掩埋有接地带的半导体芯片载体结构的半导体器件，其适于降低用于高速开关电子封装的出射和入射EMI辐射。
Electronic packages incorporating EMI shielding, and particularly semiconductor devices which incorporate semiconductor chip-carrier structures having grounded bands embedded therein which are adapted to reduce outgoing and incident EMI emissions for high-speed switching electronic packages.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | chi ; eng |
| recordid | cdi_epo_espacenet_CN1539167A |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | EMI shielding for electronic packages |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-08T21%3A39%3A47IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=MICHAEL%20A.%20GAYNES&rft.date=2004-10-20&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN1539167A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |