EMI shielding for electronic packages

EMI shielding for electronic packages

包含有EMI屏蔽的电子封装件，尤其是包含其中掩埋有接地带的半导体芯片载体结构的半导体器件，其适于降低用于高速开关电子封装的出射和入射EMI辐射。 Electronic packages incorporating EMI shielding, and particularly semiconductor devices which incorporate semiconductor chip-carrier structures having grounded bands embedded therein which are adapted to reduce outgoing and inc...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: MICHAEL A. GAYNES, JEFFREY T. COFFIN, DAVID J. ALCOE
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:包含有EMI屏蔽的电子封装件，尤其是包含其中掩埋有接地带的半导体芯片载体结构的半导体器件，其适于降低用于高速开关电子封装的出射和入射EMI辐射。 Electronic packages incorporating EMI shielding, and particularly semiconductor devices which incorporate semiconductor chip-carrier structures having grounded bands embedded therein which are adapted to reduce outgoing and incident EMI emissions for high-speed switching electronic packages.