Grinding pad collation device

The invention relates to a grinding pad finisher, including a bottom layer, a partial phase-stabilized metal oxidizing layer and diamond particles. Its disposition mode: disposing a partial phase-stabilized metal oxidizing layer on the bottom layer, and distributing the diamond particles in the meta...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YONGTAI HONG, QIDONG HUANG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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