Laminate for electronic material
本发明涉及无铅焊剂的接合所要求的吸湿后的耐热性好、适合柔性印刷电路板用或HDD悬架用的层合体。本发明的层合体由导体层和具有聚酰亚胺系树脂层(A)与聚酰亚胺系树脂层(B)的绝缘树脂层构成。构成绝缘树脂层的聚酰亚胺系树脂层(A)，由含有4，4′-二氨基-2，2′-二甲基联苯40摩尔％以上的二氨基化合物与芳香族四羧酸制得的聚酰亚胺系树脂构成，聚酰亚胺系树脂层(B)由含有从双(4-氨基苯氧基)苯或2，2-双[4-(4-氨基苯氧基)苯基]丙烷与均苯四甲酸、二苯甲酮四羧酸、二苯砜四羧酸或联苯四羧酸生成的结构单元80摩尔％以上的聚酰亚胺系树脂构成。 This invention relates to a l...
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| creator | OHTA TAKUHEI TAKARABE TAEKO HIRAISHI KATSUFUMI |
| description | 本发明涉及无铅焊剂的接合所要求的吸湿后的耐热性好、适合柔性印刷电路板用或HDD悬架用的层合体。本发明的层合体由导体层和具有聚酰亚胺系树脂层(A)与聚酰亚胺系树脂层(B)的绝缘树脂层构成。构成绝缘树脂层的聚酰亚胺系树脂层(A)，由含有4，4′-二氨基-2，2′-二甲基联苯40摩尔％以上的二氨基化合物与芳香族四羧酸制得的聚酰亚胺系树脂构成，聚酰亚胺系树脂层(B)由含有从双(4-氨基苯氧基)苯或2，2-双[4-(4-氨基苯氧基)苯基]丙烷与均苯四甲酸、二苯甲酮四羧酸、二苯砜四羧酸或联苯四羧酸生成的结构单元80摩尔％以上的聚酰亚胺系树脂构成。
This invention relates to a laminate which is excellent in heat resistance after moisture absorption required in a lead-free solder joint, and is suitable for use in flexible printed wiring boards or HDD suspensions. The laminate for electronic materials of this invention is constituted of a conductor layer and an insulating resin layer having a polyimide-based resin layer (A) and a polyimide-based resin layer (B). The polyimide-based resin layer (A) constituting the insulating layer includes a polyimide-based resin obtained by reacting a diamine containing 40 mol% or more of 4,4'-diamino-2,2'-dimethylbiphenyl with an aromatic tetracarboxylic acid, and the polyimide-based resin layer (B) includes a polyimide-based resin containing 80 mol% or more of a structural unit generated from bis(4-aminophenoxy)benzene or 2,2-bisÄ4-(4-aminophenoxy)phenylÜpropane, and pyromellitic acid, benzophenonetetracarboxylic acid, diphenylsulfonetetracarboxylic acid or biphenyltetracarboxylic acid. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN1503731A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN1503731A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN1503731A3</originalsourceid><addsrcrecordid>eNrjZFDwSczNzEssSVVIyy9SSM1JTS4pys_LTFbIBYoVZSbm8DCwpiXmFKfyQmluBnk31xBnD93Ugvz41OKCxOTUvNSSeGc_Q1MDY3NjQ0djwioAyLckdA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Laminate for electronic material</title><source>esp@cenet</source><creator>OHTA TAKUHEI ; TAKARABE TAEKO ; HIRAISHI KATSUFUMI</creator><creatorcontrib>OHTA TAKUHEI ; TAKARABE TAEKO ; HIRAISHI KATSUFUMI</creatorcontrib><description>本发明涉及无铅焊剂的接合所要求的吸湿后的耐热性好、适合柔性印刷电路板用或HDD悬架用的层合体。本发明的层合体由导体层和具有聚酰亚胺系树脂层(A)与聚酰亚胺系树脂层(B)的绝缘树脂层构成。构成绝缘树脂层的聚酰亚胺系树脂层(A)，由含有4，4′-二氨基-2，2′-二甲基联苯40摩尔％以上的二氨基化合物与芳香族四羧酸制得的聚酰亚胺系树脂构成，聚酰亚胺系树脂层(B)由含有从双(4-氨基苯氧基)苯或2，2-双[4-(4-氨基苯氧基)苯基]丙烷与均苯四甲酸、二苯甲酮四羧酸、二苯砜四羧酸或联苯四羧酸生成的结构单元80摩尔％以上的聚酰亚胺系树脂构成。
This invention relates to a laminate which is excellent in heat resistance after moisture absorption required in a lead-free solder joint, and is suitable for use in flexible printed wiring boards or HDD suspensions. The laminate for electronic materials of this invention is constituted of a conductor layer and an insulating resin layer having a polyimide-based resin layer (A) and a polyimide-based resin layer (B). The polyimide-based resin layer (A) constituting the insulating layer includes a polyimide-based resin obtained by reacting a diamine containing 40 mol% or more of 4,4'-diamino-2,2'-dimethylbiphenyl with an aromatic tetracarboxylic acid, and the polyimide-based resin layer (B) includes a polyimide-based resin containing 80 mol% or more of a structural unit generated from bis(4-aminophenoxy)benzene or 2,2-bisÄ4-(4-aminophenoxy)phenylÜpropane, and pyromellitic acid, benzophenonetetracarboxylic acid, diphenylsulfonetetracarboxylic acid or biphenyltetracarboxylic acid.</description><edition>7</edition><language>chi ; eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; TRANSPORTING</subject><creationdate>2004</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20040609&DB=EPODOC&CC=CN&NR=1503731A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25562,76317</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20040609&DB=EPODOC&CC=CN&NR=1503731A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>OHTA TAKUHEI</creatorcontrib><creatorcontrib>TAKARABE TAEKO</creatorcontrib><creatorcontrib>HIRAISHI KATSUFUMI</creatorcontrib><title>Laminate for electronic material</title><description>本发明涉及无铅焊剂的接合所要求的吸湿后的耐热性好、适合柔性印刷电路板用或HDD悬架用的层合体。本发明的层合体由导体层和具有聚酰亚胺系树脂层(A)与聚酰亚胺系树脂层(B)的绝缘树脂层构成。构成绝缘树脂层的聚酰亚胺系树脂层(A)，由含有4，4′-二氨基-2，2′-二甲基联苯40摩尔％以上的二氨基化合物与芳香族四羧酸制得的聚酰亚胺系树脂构成，聚酰亚胺系树脂层(B)由含有从双(4-氨基苯氧基)苯或2，2-双[4-(4-氨基苯氧基)苯基]丙烷与均苯四甲酸、二苯甲酮四羧酸、二苯砜四羧酸或联苯四羧酸生成的结构单元80摩尔％以上的聚酰亚胺系树脂构成。
This invention relates to a laminate which is excellent in heat resistance after moisture absorption required in a lead-free solder joint, and is suitable for use in flexible printed wiring boards or HDD suspensions. The laminate for electronic materials of this invention is constituted of a conductor layer and an insulating resin layer having a polyimide-based resin layer (A) and a polyimide-based resin layer (B). The polyimide-based resin layer (A) constituting the insulating layer includes a polyimide-based resin obtained by reacting a diamine containing 40 mol% or more of 4,4'-diamino-2,2'-dimethylbiphenyl with an aromatic tetracarboxylic acid, and the polyimide-based resin layer (B) includes a polyimide-based resin containing 80 mol% or more of a structural unit generated from bis(4-aminophenoxy)benzene or 2,2-bisÄ4-(4-aminophenoxy)phenylÜpropane, and pyromellitic acid, benzophenonetetracarboxylic acid, diphenylsulfonetetracarboxylic acid or biphenyltetracarboxylic acid.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>LAYERED PRODUCTS</subject><subject>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTED CIRCUITS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2004</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFDwSczNzEssSVVIyy9SSM1JTS4pys_LTFbIBYoVZSbm8DCwpiXmFKfyQmluBnk31xBnD93Ugvz41OKCxOTUvNSSeGc_Q1MDY3NjQ0djwioAyLckdA</recordid><startdate>20040609</startdate><enddate>20040609</enddate><creator>OHTA TAKUHEI</creator><creator>TAKARABE TAEKO</creator><creator>HIRAISHI KATSUFUMI</creator><scope>EVB</scope></search><sort><creationdate>20040609</creationdate><title>Laminate for electronic material</title><author>OHTA TAKUHEI ; TAKARABE TAEKO ; HIRAISHI KATSUFUMI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN1503731A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2004</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTED CIRCUITS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>OHTA TAKUHEI</creatorcontrib><creatorcontrib>TAKARABE TAEKO</creatorcontrib><creatorcontrib>HIRAISHI KATSUFUMI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>OHTA TAKUHEI</au><au>TAKARABE TAEKO</au><au>HIRAISHI KATSUFUMI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Laminate for electronic material</title><date>2004-06-09</date><risdate>2004</risdate><abstract>本发明涉及无铅焊剂的接合所要求的吸湿后的耐热性好、适合柔性印刷电路板用或HDD悬架用的层合体。本发明的层合体由导体层和具有聚酰亚胺系树脂层(A)与聚酰亚胺系树脂层(B)的绝缘树脂层构成。构成绝缘树脂层的聚酰亚胺系树脂层(A)，由含有4，4′-二氨基-2，2′-二甲基联苯40摩尔％以上的二氨基化合物与芳香族四羧酸制得的聚酰亚胺系树脂构成，聚酰亚胺系树脂层(B)由含有从双(4-氨基苯氧基)苯或2，2-双[4-(4-氨基苯氧基)苯基]丙烷与均苯四甲酸、二苯甲酮四羧酸、二苯砜四羧酸或联苯四羧酸生成的结构单元80摩尔％以上的聚酰亚胺系树脂构成。
This invention relates to a laminate which is excellent in heat resistance after moisture absorption required in a lead-free solder joint, and is suitable for use in flexible printed wiring boards or HDD suspensions. The laminate for electronic materials of this invention is constituted of a conductor layer and an insulating resin layer having a polyimide-based resin layer (A) and a polyimide-based resin layer (B). The polyimide-based resin layer (A) constituting the insulating layer includes a polyimide-based resin obtained by reacting a diamine containing 40 mol% or more of 4,4'-diamino-2,2'-dimethylbiphenyl with an aromatic tetracarboxylic acid, and the polyimide-based resin layer (B) includes a polyimide-based resin containing 80 mol% or more of a structural unit generated from bis(4-aminophenoxy)benzene or 2,2-bisÄ4-(4-aminophenoxy)phenylÜpropane, and pyromellitic acid, benzophenonetetracarboxylic acid, diphenylsulfonetetracarboxylic acid or biphenyltetracarboxylic acid.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING |
| title | Laminate for electronic material |
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