Testing component including work line of memory and capacitor overlaped and offset as well as its testing method

The invention relates to testing component and method, especially a testing component in slotting track for testing an offset of overlapped DRAM word line structure with deep groove capacitor. The said capacitor possesses an embedding plate, a rectangle word line covering part of deep groove capacit...

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Hauptverfasser: TIEJIANG WU, YUWEI DING, JIANZHANG HUANG
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creator TIEJIANG WU
YUWEI DING
JIANZHANG HUANG
description The invention relates to testing component and method, especially a testing component in slotting track for testing an offset of overlapped DRAM word line structure with deep groove capacitor. The said capacitor possesses an embedding plate, a rectangle word line covering part of deep groove capacitor, first and second across word lines, first and second doping areas, first and second as well as third plugs. The first plug is coupled to first doping area; second plug is coupled to second doping area; the third plug is coupled to the embedding plate. 本发明涉及一种半导体测试元件及方法,特别涉及一种用于检测动态随机存取存储器的字线结构与深沟电容器重叠是否产生偏移的测试元件,是设置于一芯片的切割道中,包括一沟道电容器,设置于上述切割道中,具有一埋入板;一矩形字线,设置于上述切割道之上,覆盖部分的深沟电容器;一第一路过字线和一第二路过字线,设置于沟道电容器上方两侧;一第一掺杂区和一第二掺杂区,分别设置于矩形字线与第一路过字线之间,以及矩形字线与第二路过字线之间;一第一接触插塞,耦接至第一掺杂区;一第二接触插塞,耦接至第二掺杂区;以及一第三接触插塞,耦接至埋入板。
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The said capacitor possesses an embedding plate, a rectangle word line covering part of deep groove capacitor, first and second across word lines, first and second doping areas, first and second as well as third plugs. The first plug is coupled to first doping area; second plug is coupled to second doping area; the third plug is coupled to the embedding plate. 本发明涉及一种半导体测试元件及方法,特别涉及一种用于检测动态随机存取存储器的字线结构与深沟电容器重叠是否产生偏移的测试元件,是设置于一芯片的切割道中,包括一沟道电容器,设置于上述切割道中,具有一埋入板;一矩形字线,设置于上述切割道之上,覆盖部分的深沟电容器;一第一路过字线和一第二路过字线,设置于沟道电容器上方两侧;一第一掺杂区和一第二掺杂区,分别设置于矩形字线与第一路过字线之间,以及矩形字线与第二路过字线之间;一第一接触插塞,耦接至第一掺杂区;一第二接触插塞,耦接至第二掺杂区;以及一第三接触插塞,耦接至埋入板。</description><edition>7</edition><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2004</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20040310&amp;DB=EPODOC&amp;CC=CN&amp;NR=1481009A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20040310&amp;DB=EPODOC&amp;CC=CN&amp;NR=1481009A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TIEJIANG WU</creatorcontrib><creatorcontrib>YUWEI DING</creatorcontrib><creatorcontrib>JIANZHANG HUANG</creatorcontrib><title>Testing component including work line of memory and capacitor overlaped and offset as well as its testing method</title><description>The invention relates to testing component and method, especially a testing component in slotting track for testing an offset of overlapped DRAM word line structure with deep groove capacitor. 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The said capacitor possesses an embedding plate, a rectangle word line covering part of deep groove capacitor, first and second across word lines, first and second doping areas, first and second as well as third plugs. The first plug is coupled to first doping area; second plug is coupled to second doping area; the third plug is coupled to the embedding plate. 本发明涉及一种半导体测试元件及方法,特别涉及一种用于检测动态随机存取存储器的字线结构与深沟电容器重叠是否产生偏移的测试元件,是设置于一芯片的切割道中,包括一沟道电容器,设置于上述切割道中,具有一埋入板;一矩形字线,设置于上述切割道之上,覆盖部分的深沟电容器;一第一路过字线和一第二路过字线,设置于沟道电容器上方两侧;一第一掺杂区和一第二掺杂区,分别设置于矩形字线与第一路过字线之间,以及矩形字线与第二路过字线之间;一第一接触插塞,耦接至第一掺杂区;一第二接触插塞,耦接至第二掺杂区;以及一第三接触插塞,耦接至埋入板。</abstract><edition>7</edition><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Testing component including work line of memory and capacitor overlaped and offset as well as its testing method
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