Heat sink and mfg. method thereof
A radiation device consists of radiation seat made of copper plate and radiation fin which is formed by plurality of thin copper sheets arranged in parallel and in vertical to the radiation seat as they are connected into one body by soldering. The febrication steps of it are as follows: to make the...
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creator | BOYONG LIN |
description | A radiation device consists of radiation seat made of copper plate and radiation fin which is formed by plurality of thin copper sheets arranged in parallel and in vertical to the radiation seat as they are connected into one body by soldering. The febrication steps of it are as follows: to make the copper plate and copper sheet into a presetting shape of radiation seat or radiation fin by punching press separately first and then to carry on the polishing process for the surface of radiation seat, to place the radiation seat and fin in the protective gas to carry on cheaning process to removethe oil dirt on the surface and to carry on ageing process, to coat the silver. Solder paster in between the radiation seat and fin and to place them in the furnace for silver soldering treatment, tomake antioxidation treatment of copper in radiation seat and fin after they are out of the furnace. |
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The febrication steps of it are as follows: to make the copper plate and copper sheet into a presetting shape of radiation seat or radiation fin by punching press separately first and then to carry on the polishing process for the surface of radiation seat, to place the radiation seat and fin in the protective gas to carry on cheaning process to removethe oil dirt on the surface and to carry on ageing process, to coat the silver. Solder paster in between the radiation seat and fin and to place them in the furnace for silver soldering treatment, tomake antioxidation treatment of copper in radiation seat and fin after they are out of the furnace.</description><edition>7</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CALCULATING ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; COMPUTING ; COUNTING ; ELECTRIC DIGITAL DATA PROCESSING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PHYSICS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>2003</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20030528&DB=EPODOC&CC=CN&NR=1420718A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20030528&DB=EPODOC&CC=CN&NR=1420718A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>BOYONG LIN</creatorcontrib><title>Heat sink and mfg. method thereof</title><description>A radiation device consists of radiation seat made of copper plate and radiation fin which is formed by plurality of thin copper sheets arranged in parallel and in vertical to the radiation seat as they are connected into one body by soldering. The febrication steps of it are as follows: to make the copper plate and copper sheet into a presetting shape of radiation seat or radiation fin by punching press separately first and then to carry on the polishing process for the surface of radiation seat, to place the radiation seat and fin in the protective gas to carry on cheaning process to removethe oil dirt on the surface and to carry on ageing process, to coat the silver. Solder paster in between the radiation seat and fin and to place them in the furnace for silver soldering treatment, tomake antioxidation treatment of copper in radiation seat and fin after they are out of the furnace.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CALCULATING</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>COMPUTING</subject><subject>COUNTING</subject><subject>ELECTRIC DIGITAL DATA PROCESSING</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PHYSICS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2003</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFD0SE0sUSjOzMtWSMxLUchNS9dTyE0tychPUSjJSC1KzU_jYWBNS8wpTuWF0twM8m6uIc4euqkF-fGpxQWJyal5qSXxzn6GJkYG5oYWjsaEVQAApDEkEg</recordid><startdate>20030528</startdate><enddate>20030528</enddate><creator>BOYONG LIN</creator><scope>EVB</scope></search><sort><creationdate>20030528</creationdate><title>Heat sink and mfg. method thereof</title><author>BOYONG LIN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN1420718A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2003</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CALCULATING</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>COMPUTING</topic><topic>COUNTING</topic><topic>ELECTRIC DIGITAL DATA PROCESSING</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PHYSICS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>BOYONG LIN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>BOYONG LIN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Heat sink and mfg. method thereof</title><date>2003-05-28</date><risdate>2003</risdate><abstract>A radiation device consists of radiation seat made of copper plate and radiation fin which is formed by plurality of thin copper sheets arranged in parallel and in vertical to the radiation seat as they are connected into one body by soldering. The febrication steps of it are as follows: to make the copper plate and copper sheet into a presetting shape of radiation seat or radiation fin by punching press separately first and then to carry on the polishing process for the surface of radiation seat, to place the radiation seat and fin in the protective gas to carry on cheaning process to removethe oil dirt on the surface and to carry on ageing process, to coat the silver. Solder paster in between the radiation seat and fin and to place them in the furnace for silver soldering treatment, tomake antioxidation treatment of copper in radiation seat and fin after they are out of the furnace.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRIC ELEMENTS CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PHYSICS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
title | Heat sink and mfg. method thereof |
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