Composition for removing etching resisting agent and byproducts and use thereof

Resist-removing composition comprises an N-hydroxyalkyl alkoxyalkanamide (I) and a swelling agent. An independent claim is also included for a process for removing a resist layer from a substrate, comprising contacting the substrate with a composition as above.

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Bibliographische Detailangaben
Hauptverfasser: BOK GAN CHIN, CHON SANG MOON, KIM GYONG DAI
Format: Patent
Sprache:eng
Schlagworte:
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