Adhesive tape backing
Adhesive tape backings comprising isotactic polypropylene blended or mixed with at least a second polyolefin. The backing is biaxially stretched so as to provide a film having any one or a combination of the following preferred characteristics:A. Puncture energy up to 20 J/cm2 when 2.54 cm wide samp...
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creator | P.J. HAGER R.E. KOZULLA J.T. BARTUSIAK |
description | Adhesive tape backings comprising isotactic polypropylene blended or mixed with at least a second polyolefin. The backing is biaxially stretched so as to provide a film having any one or a combination of the following preferred characteristics:A. Puncture energy up to 20 J/cm2 when 2.54 cm wide samples are tested by the method set herein, or up to 90 J/cm2 when 1.27 cm wide samples are tested by the method set out herein.B. Puncture elongation up to about 1.3 cm when 2.54 cm wide samples are tested by the method set out herein, or up to 2.0 cm when 1.27 cm wide samples are tested by the method set out herein.C. Tensile strength up to 140 MPa in the MD.In a preferred embodiment, the second component comprises polyethylene, polybutylene, or syndiotactic polypropylene. |
format | Patent |
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The backing is biaxially stretched so as to provide a film having any one or a combination of the following preferred characteristics:A. Puncture energy up to 20 J/cm2 when 2.54 cm wide samples are tested by the method set herein, or up to 90 J/cm2 when 1.27 cm wide samples are tested by the method set out herein.B. Puncture elongation up to about 1.3 cm when 2.54 cm wide samples are tested by the method set out herein, or up to 2.0 cm when 1.27 cm wide samples are tested by the method set out herein.C. Tensile strength up to 140 MPa in the MD.In a preferred embodiment, the second component comprises polyethylene, polybutylene, or syndiotactic polypropylene.</description><edition>7</edition><language>eng</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; DYES ; GENERAL PROCESSES OF COMPOUNDING ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; ORGANIC MACROMOLECULAR COMPOUNDS ; PAINTS ; POLISHES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF MATERIALS AS ADHESIVES ; WORKING-UP</subject><creationdate>2002</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20020605&DB=EPODOC&CC=CN&NR=1352675A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20020605&DB=EPODOC&CC=CN&NR=1352675A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>P.J. HAGER</creatorcontrib><creatorcontrib>R.E. KOZULLA</creatorcontrib><creatorcontrib>J.T. BARTUSIAK</creatorcontrib><title>Adhesive tape backing</title><description>Adhesive tape backings comprising isotactic polypropylene blended or mixed with at least a second polyolefin. The backing is biaxially stretched so as to provide a film having any one or a combination of the following preferred characteristics:A. Puncture energy up to 20 J/cm2 when 2.54 cm wide samples are tested by the method set herein, or up to 90 J/cm2 when 1.27 cm wide samples are tested by the method set out herein.B. Puncture elongation up to about 1.3 cm when 2.54 cm wide samples are tested by the method set out herein, or up to 2.0 cm when 1.27 cm wide samples are tested by the method set out herein.C. Tensile strength up to 140 MPa in the MD.In a preferred embodiment, the second component comprises polyethylene, polybutylene, or syndiotactic polypropylene.</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>DYES</subject><subject>GENERAL PROCESSES OF COMPOUNDING</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><subject>WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2002</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBB1TMlILc4sS1UoSSxIVUhKTM7OzEvnYWBNS8wpTuWF0twM8m6uIc4euqkF-fGpxQWJyal5qSXxzn6GxqZGZuamjsaEVQAA4BkgFA</recordid><startdate>20020605</startdate><enddate>20020605</enddate><creator>P.J. HAGER</creator><creator>R.E. KOZULLA</creator><creator>J.T. BARTUSIAK</creator><scope>EVB</scope></search><sort><creationdate>20020605</creationdate><title>Adhesive tape backing</title><author>P.J. HAGER ; R.E. KOZULLA ; J.T. BARTUSIAK</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN1352675A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2002</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>DYES</topic><topic>GENERAL PROCESSES OF COMPOUNDING</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><topic>WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>P.J. HAGER</creatorcontrib><creatorcontrib>R.E. KOZULLA</creatorcontrib><creatorcontrib>J.T. BARTUSIAK</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>P.J. HAGER</au><au>R.E. KOZULLA</au><au>J.T. BARTUSIAK</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Adhesive tape backing</title><date>2002-06-05</date><risdate>2002</risdate><abstract>Adhesive tape backings comprising isotactic polypropylene blended or mixed with at least a second polyolefin. The backing is biaxially stretched so as to provide a film having any one or a combination of the following preferred characteristics:A. Puncture energy up to 20 J/cm2 when 2.54 cm wide samples are tested by the method set herein, or up to 90 J/cm2 when 1.27 cm wide samples are tested by the method set out herein.B. Puncture elongation up to about 1.3 cm when 2.54 cm wide samples are tested by the method set out herein, or up to 2.0 cm when 1.27 cm wide samples are tested by the method set out herein.C. Tensile strength up to 140 MPa in the MD.In a preferred embodiment, the second component comprises polyethylene, polybutylene, or syndiotactic polypropylene.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES GENERAL PROCESSES OF COMPOUNDING METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES WORKING-UP |
title | Adhesive tape backing |
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