Connection structure for display module and printed base plate and semiconductor device, display module and electronic member
A connection structure for connecting a display module and a printed substrate is provided, which is appropriate for use in mass production of electronic devices such as a cellular phone in which, while a thin mounting is desired, many components have to be mounted on the printed substrate and the d...
Gespeichert in:
Hauptverfasser: | , , |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
container_end_page | |
---|---|
container_issue | |
container_start_page | |
container_title | |
container_volume | |
creator | TOMOKUNI HIROAKI SENKAWA YASUKEN SATO KUNHIRO |
description | A connection structure for connecting a display module and a printed substrate is provided, which is appropriate for use in mass production of electronic devices such as a cellular phone in which, while a thin mounting is desired, many components have to be mounted on the printed substrate and the display module is required to be mounted in predetermined space on the printed substrate. The liquid crystal module is provided with a pin electrode on an external connection terminal of its COF, and fixed to a housing in a folded state with respective rear surfaces of the COF and a liquid crystal panel facing each other. A holding member for engaging the printed substrate and holding the printed substrate is formed on the housing. When the holding member engages the printed substrate, the liquid crystal module is fixed to the printed substrate, and at the same time, the pin electrode of the COF and a through hole electrode of the printed substrate are electrically connected. |
format | Patent |
fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN1340881A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN1340881A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN1340881A3</originalsourceid><addsrcrecordid>eNqFjbEKwjAURbs4iPoNvg9QsNShawmKk5N7SZNbCCTvhSQVHPx3KzoKThfuPYe7rJ5KmGGKE6Zc0mTKlECjJLIuR68fFMROHqTZUkyOCywNOoPmsXzqjOCMsJ3lt4e7M9j98uHnpyTsDAWEAWldLUbtMzbfXFXb8-mmLntE6ZGjNmCUXl3r5nho27pr_hMvg_1HzQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Connection structure for display module and printed base plate and semiconductor device, display module and electronic member</title><source>esp@cenet</source><creator>TOMOKUNI HIROAKI ; SENKAWA YASUKEN ; SATO KUNHIRO</creator><creatorcontrib>TOMOKUNI HIROAKI ; SENKAWA YASUKEN ; SATO KUNHIRO</creatorcontrib><description>A connection structure for connecting a display module and a printed substrate is provided, which is appropriate for use in mass production of electronic devices such as a cellular phone in which, while a thin mounting is desired, many components have to be mounted on the printed substrate and the display module is required to be mounted in predetermined space on the printed substrate. The liquid crystal module is provided with a pin electrode on an external connection terminal of its COF, and fixed to a housing in a folded state with respective rear surfaces of the COF and a liquid crystal panel facing each other. A holding member for engaging the printed substrate and holding the printed substrate is formed on the housing. When the holding member engages the printed substrate, the liquid crystal module is fixed to the printed substrate, and at the same time, the pin electrode of the COF and a through hole electrode of the printed substrate are electrically connected.</description><edition>7</edition><language>eng</language><subject>ADVERTISING ; BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CRYPTOGRAPHY ; CURRENT COLLECTORS ; DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING ; DISPLAY ; DISPLAYING ; EDUCATION ; ELECTRIC COMMUNICATION TECHNIQUE ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FREQUENCY-CHANGING ; LABELS OR NAME-PLATES ; LINE CONNECTORS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; NON-LINEAR OPTICS ; OPTICAL ANALOGUE/DIGITAL CONVERTERS ; OPTICAL LOGIC ELEMENTS ; OPTICS ; PHYSICS ; PRINTED CIRCUITS ; SEALS ; SIGNS ; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF ; TELEPHONIC COMMUNICATION</subject><creationdate>2002</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20020320&DB=EPODOC&CC=CN&NR=1340881A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20020320&DB=EPODOC&CC=CN&NR=1340881A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TOMOKUNI HIROAKI</creatorcontrib><creatorcontrib>SENKAWA YASUKEN</creatorcontrib><creatorcontrib>SATO KUNHIRO</creatorcontrib><title>Connection structure for display module and printed base plate and semiconductor device, display module and electronic member</title><description>A connection structure for connecting a display module and a printed substrate is provided, which is appropriate for use in mass production of electronic devices such as a cellular phone in which, while a thin mounting is desired, many components have to be mounted on the printed substrate and the display module is required to be mounted in predetermined space on the printed substrate. The liquid crystal module is provided with a pin electrode on an external connection terminal of its COF, and fixed to a housing in a folded state with respective rear surfaces of the COF and a liquid crystal panel facing each other. A holding member for engaging the printed substrate and holding the printed substrate is formed on the housing. When the holding member engages the printed substrate, the liquid crystal module is fixed to the printed substrate, and at the same time, the pin electrode of the COF and a through hole electrode of the printed substrate are electrically connected.</description><subject>ADVERTISING</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CRYPTOGRAPHY</subject><subject>CURRENT COLLECTORS</subject><subject>DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING</subject><subject>DISPLAY</subject><subject>DISPLAYING</subject><subject>EDUCATION</subject><subject>ELECTRIC COMMUNICATION TECHNIQUE</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FREQUENCY-CHANGING</subject><subject>LABELS OR NAME-PLATES</subject><subject>LINE CONNECTORS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>NON-LINEAR OPTICS</subject><subject>OPTICAL ANALOGUE/DIGITAL CONVERTERS</subject><subject>OPTICAL LOGIC ELEMENTS</subject><subject>OPTICS</subject><subject>PHYSICS</subject><subject>PRINTED CIRCUITS</subject><subject>SEALS</subject><subject>SIGNS</subject><subject>TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF</subject><subject>TELEPHONIC COMMUNICATION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2002</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqFjbEKwjAURbs4iPoNvg9QsNShawmKk5N7SZNbCCTvhSQVHPx3KzoKThfuPYe7rJ5KmGGKE6Zc0mTKlECjJLIuR68fFMROHqTZUkyOCywNOoPmsXzqjOCMsJ3lt4e7M9j98uHnpyTsDAWEAWldLUbtMzbfXFXb8-mmLntE6ZGjNmCUXl3r5nho27pr_hMvg_1HzQ</recordid><startdate>20020320</startdate><enddate>20020320</enddate><creator>TOMOKUNI HIROAKI</creator><creator>SENKAWA YASUKEN</creator><creator>SATO KUNHIRO</creator><scope>EVB</scope></search><sort><creationdate>20020320</creationdate><title>Connection structure for display module and printed base plate and semiconductor device, display module and electronic member</title><author>TOMOKUNI HIROAKI ; SENKAWA YASUKEN ; SATO KUNHIRO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN1340881A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2002</creationdate><topic>ADVERTISING</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CRYPTOGRAPHY</topic><topic>CURRENT COLLECTORS</topic><topic>DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING</topic><topic>DISPLAY</topic><topic>DISPLAYING</topic><topic>EDUCATION</topic><topic>ELECTRIC COMMUNICATION TECHNIQUE</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FREQUENCY-CHANGING</topic><topic>LABELS OR NAME-PLATES</topic><topic>LINE CONNECTORS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>NON-LINEAR OPTICS</topic><topic>OPTICAL ANALOGUE/DIGITAL CONVERTERS</topic><topic>OPTICAL LOGIC ELEMENTS</topic><topic>OPTICS</topic><topic>PHYSICS</topic><topic>PRINTED CIRCUITS</topic><topic>SEALS</topic><topic>SIGNS</topic><topic>TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF</topic><topic>TELEPHONIC COMMUNICATION</topic><toplevel>online_resources</toplevel><creatorcontrib>TOMOKUNI HIROAKI</creatorcontrib><creatorcontrib>SENKAWA YASUKEN</creatorcontrib><creatorcontrib>SATO KUNHIRO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TOMOKUNI HIROAKI</au><au>SENKAWA YASUKEN</au><au>SATO KUNHIRO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Connection structure for display module and printed base plate and semiconductor device, display module and electronic member</title><date>2002-03-20</date><risdate>2002</risdate><abstract>A connection structure for connecting a display module and a printed substrate is provided, which is appropriate for use in mass production of electronic devices such as a cellular phone in which, while a thin mounting is desired, many components have to be mounted on the printed substrate and the display module is required to be mounted in predetermined space on the printed substrate. The liquid crystal module is provided with a pin electrode on an external connection terminal of its COF, and fixed to a housing in a folded state with respective rear surfaces of the COF and a liquid crystal panel facing each other. A holding member for engaging the printed substrate and holding the printed substrate is formed on the housing. When the holding member engages the printed substrate, the liquid crystal module is fixed to the printed substrate, and at the same time, the pin electrode of the COF and a through hole electrode of the printed substrate are electrically connected.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
fulltext | fulltext_linktorsrc |
identifier | |
ispartof | |
issn | |
language | eng |
recordid | cdi_epo_espacenet_CN1340881A |
source | esp@cenet |
subjects | ADVERTISING BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CRYPTOGRAPHY CURRENT COLLECTORS DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING DISPLAY DISPLAYING EDUCATION ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FREQUENCY-CHANGING LABELS OR NAME-PLATES LINE CONNECTORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PHYSICS PRINTED CIRCUITS SEALS SIGNS TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF TELEPHONIC COMMUNICATION |
title | Connection structure for display module and printed base plate and semiconductor device, display module and electronic member |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-08T23%3A12%3A45IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=TOMOKUNI%20HIROAKI&rft.date=2002-03-20&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN1340881A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |