Low contaminatino, high density plasma etch chamber and method for making the same

A plasma processing chamber having a chamber liner and a liner support, the liner support including a flexible wall configured to surround an external surface of the chamber liner, the flexible wall being spaced apart from the wall of the chamber liner. The apparatus can include a heater thermally c...

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Bibliographische Detailangaben
1. Verfasser: THOMAS E. WICKER,ROBERT A. MARASCHIN,WILLIAM S. KENNEDY
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A plasma processing chamber having a chamber liner and a liner support, the liner support including a flexible wall configured to surround an external surface of the chamber liner, the flexible wall being spaced apart from the wall of the chamber liner. The apparatus can include a heater thermally connected to the liner support so as to thermally conduct heat from the liner support to the chamber liner. The liner support can be made from flexible aluminum material and the chamber liner comprises a ceramic material. The flexible wall can include slots which divide the liner support into a plurality of fingers which enable the flexible wall to absorb thermal stresses.