Integrated circuit with power supply test interface

An integrated circuit assembly contains a carrier and a semi-conductor integrated circuit chip 10. A current path on the carrier supplies power to power supply connection of the chip. A magnetic field sensor is provided on the carrier in a vicinity of the current path, for sensing a magnetic field g...

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1. Verfasser: F.G.M. DE JONG,R.F. SCHUTTERT,J. DEWITDE
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description An integrated circuit assembly contains a carrier and a semi-conductor integrated circuit chip 10. A current path on the carrier supplies power to power supply connection of the chip. A magnetic field sensor is provided on the carrier in a vicinity of the current path, for sensing a magnetic field generated by a current through the current path. The assembly contains test-accessible electronic interface to the magnetic field sensor, for testing presence of the current. Preferably the sensors are integrated on the carrier by depositing magneto resistive material and patterning the material so as to provide sensors in the vicinity of current paths. Also preferably, the carrier is an interposer 12 with connecting wiring, which is packaged with one or more integrated circuit chips before mounting the interposer on a printed circuit board 19.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN1314975CC</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN1314975CC</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN1314975CC3</originalsourceid><addsrcrecordid>eNrjZDD2zCtJTS9KLElNUUjOLEouzSxRKM8syVAoyC9PLVIoLi0oyKlUKEktLlHIBKosSktMTuVhYE1LzClO5YXS3AwKbq4hzh66qQX58anFBUAleakl8c5-hsaGJpbmps7OxkQoAQDcOiyf</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Integrated circuit with power supply test interface</title><source>esp@cenet</source><creator>F.G.M. DE JONG,R.F. SCHUTTERT,J. DEWITDE</creator><creatorcontrib>F.G.M. DE JONG,R.F. SCHUTTERT,J. DEWITDE</creatorcontrib><description>An integrated circuit assembly contains a carrier and a semi-conductor integrated circuit chip 10. A current path on the carrier supplies power to power supply connection of the chip. A magnetic field sensor is provided on the carrier in a vicinity of the current path, for sensing a magnetic field generated by a current through the current path. The assembly contains test-accessible electronic interface to the magnetic field sensor, for testing presence of the current. Preferably the sensors are integrated on the carrier by depositing magneto resistive material and patterning the material so as to provide sensors in the vicinity of current paths. Also preferably, the carrier is an interposer 12 with connecting wiring, which is packaged with one or more integrated circuit chips before mounting the interposer on a printed circuit board 19.</description><language>eng</language><subject>MEASURING ; MEASURING ELECTRIC VARIABLES ; MEASURING MAGNETIC VARIABLES ; PHYSICS ; TESTING</subject><creationdate>2007</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20070509&amp;DB=EPODOC&amp;CC=CN&amp;NR=1314975C$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25562,76317</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20070509&amp;DB=EPODOC&amp;CC=CN&amp;NR=1314975C$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>F.G.M. DE JONG,R.F. SCHUTTERT,J. DEWITDE</creatorcontrib><title>Integrated circuit with power supply test interface</title><description>An integrated circuit assembly contains a carrier and a semi-conductor integrated circuit chip 10. A current path on the carrier supplies power to power supply connection of the chip. A magnetic field sensor is provided on the carrier in a vicinity of the current path, for sensing a magnetic field generated by a current through the current path. The assembly contains test-accessible electronic interface to the magnetic field sensor, for testing presence of the current. Preferably the sensors are integrated on the carrier by depositing magneto resistive material and patterning the material so as to provide sensors in the vicinity of current paths. Also preferably, the carrier is an interposer 12 with connecting wiring, which is packaged with one or more integrated circuit chips before mounting the interposer on a printed circuit board 19.</description><subject>MEASURING</subject><subject>MEASURING ELECTRIC VARIABLES</subject><subject>MEASURING MAGNETIC VARIABLES</subject><subject>PHYSICS</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2007</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDD2zCtJTS9KLElNUUjOLEouzSxRKM8syVAoyC9PLVIoLi0oyKlUKEktLlHIBKosSktMTuVhYE1LzClO5YXS3AwKbq4hzh66qQX58anFBUAleakl8c5-hsaGJpbmps7OxkQoAQDcOiyf</recordid><startdate>20070509</startdate><enddate>20070509</enddate><creator>F.G.M. DE JONG,R.F. SCHUTTERT,J. DEWITDE</creator><scope>EVB</scope></search><sort><creationdate>20070509</creationdate><title>Integrated circuit with power supply test interface</title><author>F.G.M. DE JONG,R.F. SCHUTTERT,J. DEWITDE</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN1314975CC3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2007</creationdate><topic>MEASURING</topic><topic>MEASURING ELECTRIC VARIABLES</topic><topic>MEASURING MAGNETIC VARIABLES</topic><topic>PHYSICS</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>F.G.M. DE JONG,R.F. SCHUTTERT,J. DEWITDE</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>F.G.M. DE JONG,R.F. SCHUTTERT,J. DEWITDE</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Integrated circuit with power supply test interface</title><date>2007-05-09</date><risdate>2007</risdate><abstract>An integrated circuit assembly contains a carrier and a semi-conductor integrated circuit chip 10. A current path on the carrier supplies power to power supply connection of the chip. A magnetic field sensor is provided on the carrier in a vicinity of the current path, for sensing a magnetic field generated by a current through the current path. The assembly contains test-accessible electronic interface to the magnetic field sensor, for testing presence of the current. Preferably the sensors are integrated on the carrier by depositing magneto resistive material and patterning the material so as to provide sensors in the vicinity of current paths. Also preferably, the carrier is an interposer 12 with connecting wiring, which is packaged with one or more integrated circuit chips before mounting the interposer on a printed circuit board 19.</abstract><oa>free_for_read</oa></addata></record>
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subjects MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
TESTING
title Integrated circuit with power supply test interface
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-14T16%3A28%3A18IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=F.G.M.%20DE%20JONG,R.F.%20SCHUTTERT,J.%20DEWITDE&rft.date=2007-05-09&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN1314975CC%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true