Flexible wiring board with multilayer structure and its making method
A multilayer flexible wiring board, suited for mounting semiconductor elements. The flexible wiring board is fabricated in the following manner. A flexible wiring board piece having a metal wiring, in which a metal coating is exposed on at least a part of surface of the metal wiring, is adhered to a...
Gespeichert in:
| Hauptverfasser: | , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | HISHINUMA HIROYUKI KISHIMOTO SOICHIRO |
| description | A multilayer flexible wiring board, suited for mounting semiconductor elements. The flexible wiring board is fabricated in the following manner. A flexible wiring board piece having a metal wiring, in which a metal coating is exposed on at least a part of surface of the metal wiring, is adhered to another flexible wiring board piece having a metal projection on which a metal coating is formed. One of or both of the metal coatings on the metal wiring and the metal projection is composed of a soft metal coating a surface of which has a Vickers' hardness of 80 kgf/mm or lower. The metal coating of the metal wiring contacts with the metal coating of said metal projection and ultrasonic wave is applied thereto to connect the metal wiring with the metal projection. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN1304284A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN1304284A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN1304284A3</originalsourceid><addsrcrecordid>eNrjZHB1y0mtyEzKSVUozyzKzEtXSMpPLEoBckoyFHJLc0oycxIrU4sUikuKSpNLSotSFRLzUhQyS4oVchOzQcpzU0sy8lN4GFjTEnOKU3mhNDeDvJtriLOHbmpBfnxqcUFicmpeakm8s5-hsYGJkYWJozFhFQBS1TKn</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Flexible wiring board with multilayer structure and its making method</title><source>esp@cenet</source><creator>HISHINUMA HIROYUKI ; KISHIMOTO SOICHIRO</creator><creatorcontrib>HISHINUMA HIROYUKI ; KISHIMOTO SOICHIRO</creatorcontrib><description>A multilayer flexible wiring board, suited for mounting semiconductor elements. The flexible wiring board is fabricated in the following manner. A flexible wiring board piece having a metal wiring, in which a metal coating is exposed on at least a part of surface of the metal wiring, is adhered to another flexible wiring board piece having a metal projection on which a metal coating is formed. One of or both of the metal coatings on the metal wiring and the metal projection is composed of a soft metal coating a surface of which has a Vickers' hardness of 80 kgf/mm or lower. The metal coating of the metal wiring contacts with the metal coating of said metal projection and ultrasonic wave is applied thereto to connect the metal wiring with the metal projection.</description><edition>7</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>2001</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20010718&DB=EPODOC&CC=CN&NR=1304284A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20010718&DB=EPODOC&CC=CN&NR=1304284A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HISHINUMA HIROYUKI</creatorcontrib><creatorcontrib>KISHIMOTO SOICHIRO</creatorcontrib><title>Flexible wiring board with multilayer structure and its making method</title><description>A multilayer flexible wiring board, suited for mounting semiconductor elements. The flexible wiring board is fabricated in the following manner. A flexible wiring board piece having a metal wiring, in which a metal coating is exposed on at least a part of surface of the metal wiring, is adhered to another flexible wiring board piece having a metal projection on which a metal coating is formed. One of or both of the metal coatings on the metal wiring and the metal projection is composed of a soft metal coating a surface of which has a Vickers' hardness of 80 kgf/mm or lower. The metal coating of the metal wiring contacts with the metal coating of said metal projection and ultrasonic wave is applied thereto to connect the metal wiring with the metal projection.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2001</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHB1y0mtyEzKSVUozyzKzEtXSMpPLEoBckoyFHJLc0oycxIrU4sUikuKSpNLSotSFRLzUhQyS4oVchOzQcpzU0sy8lN4GFjTEnOKU3mhNDeDvJtriLOHbmpBfnxqcUFicmpeakm8s5-hsYGJkYWJozFhFQBS1TKn</recordid><startdate>20010718</startdate><enddate>20010718</enddate><creator>HISHINUMA HIROYUKI</creator><creator>KISHIMOTO SOICHIRO</creator><scope>EVB</scope></search><sort><creationdate>20010718</creationdate><title>Flexible wiring board with multilayer structure and its making method</title><author>HISHINUMA HIROYUKI ; KISHIMOTO SOICHIRO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN1304284A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2001</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>HISHINUMA HIROYUKI</creatorcontrib><creatorcontrib>KISHIMOTO SOICHIRO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HISHINUMA HIROYUKI</au><au>KISHIMOTO SOICHIRO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Flexible wiring board with multilayer structure and its making method</title><date>2001-07-18</date><risdate>2001</risdate><abstract>A multilayer flexible wiring board, suited for mounting semiconductor elements. The flexible wiring board is fabricated in the following manner. A flexible wiring board piece having a metal wiring, in which a metal coating is exposed on at least a part of surface of the metal wiring, is adhered to another flexible wiring board piece having a metal projection on which a metal coating is formed. One of or both of the metal coatings on the metal wiring and the metal projection is composed of a soft metal coating a surface of which has a Vickers' hardness of 80 kgf/mm or lower. The metal coating of the metal wiring contacts with the metal coating of said metal projection and ultrasonic wave is applied thereto to connect the metal wiring with the metal projection.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_CN1304284A |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | Flexible wiring board with multilayer structure and its making method |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-27T06%3A17%3A50IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=HISHINUMA%20HIROYUKI&rft.date=2001-07-18&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN1304284A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |