Semiconductor integrated circuit device

In a CMOS gate array, each of bonding pads corresponding to input cells for signals and bonding pads corresponding to input cells for supply voltages is formed of a plurality of conductor layers, whereas each of bonding pads (non-connected pads) corresponding to input/output cells not to be used is...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	TAKAYUKI NOTO, YAHIRO SHIOTSUKI, EIJI OI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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