Negative photosensitive resin composition, dry film, cured product, and electronic component

Provided is a novel negative-type photosensitive resin composition having more excellent resolution and insulation reliability. The negative photosensitive resin composition is characterized by containing (A) a polyhydroxy amide compound containing a structural unit represented by formula (1), (B) an oxime sulfonic acid ester compound, and (C) a cross-linking agent, the weight-average molecular weight of the polyhydroxy amide compound (A) being 2000-20000, the polyhydroxy amide compound (A) not containing a carboxyl group or having a carboxyl group equivalent of 1500 g/eq or more, and the cross-linking agent (C) being a polyhydroxy amide compound having a weight-average molecular weight of 2000-20000. The crosslinking agent (C) contains a plurality of methoxymethyl groups and/or hydroxymethyl groups. (In formula (1), R1 is a divalent organic group, and R2 is a tetravalent organic group. ). # imgabs0 # 提供具有更优异的分辨率和绝缘可靠性的新的负型感光性树脂组合物。一种负型感光性树脂组合物，其特征在于，含有：包含下式(1)所示的结构单元的(A)多羟基酰胺化合物、(B)肟磺酸酯化合物和(C)交联剂，前述(A)多羟基酰胺化